Volume 48, Issue 1

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January 2019

Special Sections: TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder. Guest Editors: Kazuhiro Nogita, Fan-Yi Ouyang, Sergey A. Belyakov, Chih Chen, Christopher M. Gourlay, Kwang-Lung Lin, Won-sik Hong, Mehran Maalekian; and TMS2018 Phase Stability in Electronic Materials. Guest Editor: Shih-kang Lin

80 articles in this issue

Superior Reliability of SAC105 Solder on BGA Package Pad with NiPdAu Coating
Chao Huang
Li Rao
Ming Li
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 18 July 2018 Pages: 1 - 8
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Effects of Aspect Ratio on Microstructural Evolution of Ni/Sn/Ni Microjoints
T. H. Yang
H. Y. Yu
C. R. Kao
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 16 August 2018 Pages: 9 - 16
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Studying the Effect of Grain Size on Whisker Nucleation and Growth Kinetics Using Thermal Strain
Eric Chason
Fei Pei
Andrew Hitt
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 20 August 2018 Pages: 17 - 24
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications
Y. W. Wang
W. L. Shih
C. R. Kao
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 22 August 2018 Pages: 25 - 31
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Solid-State Diffusion of Bi in Sn: Effects of β-Sn Grain Orientation
André M. Delhaise
Zhangqi Chen
Doug D. Perovic
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 10 September 2018 Pages: 32 - 43
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Corrosion-Induced Mass Loss of Cu₉Al₄ at the Cu-Al Ball–Bond Interface: Explained Based on Full Immersion of Cu, Al, and Cu-Al Intermetallic Galvanic Couples
Yuelin Wu
Andre Lee
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 10 September 2018 Pages: 44 - 52
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Co-P Diffusion Barrier for p-Bi₂Te₃ Thermoelectric Material
Chun-Hsien Wang
Hsien-Chien Hsieh
Albert T. Wu
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 01 October 2018 Pages: 53 - 57
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Nucleation and Growth of Tin Hillocks by In Situ Nanoindentation
Irene Lujan-Regalado
Antony Kirubanandham
Nikhilesh Chawla
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 24 September 2018 Pages: 58 - 71
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Room Temperature Bonding on Interface Between Metal and Ceramic
Kyu-Bong Jang
Sungwook Mhin
Soong-Keun Hyun
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 02 October 2018 Pages: 72 - 78
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Facile Design of Conductive Ag-PDMS Electrodes for Stretchable Electrodes
Kyoung Ryeol Park
Jae Eun Jeon
Sungwook Mhin
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 15 October 2018 Pages: 79 - 84
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-Free Solder
Chemo-thermo-mechanically Coupled Crystal Plasticity Simulation of Stress Evolution in Thermally Strained β-Sn Films
Aritra Chakraborty
Philip Eisenlohr
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 23 October 2018 Pages: 85 - 91
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
The Potential for Metal–Carbon Nanotubes Composites as Interconnects
Leila Ladani
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 17 October 2018 Pages: 92 - 98
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Wetting and IMC Growth Behavior Between Cu Substrate and Zn-25Sn-xCu-yTi High-Temperature Solder Alloys
Darwin Sarwono
Kwang-Lung Lin
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 30 October 2018 Pages: 99 - 106
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder
Tianhong Gu
Christopher M. Gourlay
T. Ben Britton
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder Open access 30 October 2018 Pages: 107 - 121
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Silver Sintered Joint Property Between Silicon Carbide Device and Ceramic Substrate for Electric Vehicle Power Module
Won Sik Hong
Mi Song Kim
Chulmin Oh
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 19 November 2018 Pages: 122 - 134
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders
Che-Wei Chang
Kwang-Lung Lin
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 07 November 2018 Pages: 135 - 141
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-Free Solder
Modeling and Experimental Verification of Intermetallic Compounds Grown by Electromigration and Thermomigration for Sn-0.7Cu Solders
Sung-Min Baek
Yujin Park
Namhyun Kang
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 26 November 2018 Pages: 142 - 151
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Mechanism of the Local Cu Protrusion in Cu-Filled Through Silicon Vias Under Heat Treatment
Xuewei Zhao
Limin Ma
Fu Guo
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 21 November 2018 Pages: 152 - 158
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Heating Rate Dependence of the Mechanisms of Copper Pumping in Through-Silicon Vias
Hanry Yang
Tae-Kyu Lee
Indranath Dutta
TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder 21 November 2018 Pages: 159 - 169
Part of 1 collection:

TMS2018 Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Study of Interfacial Reactions Between Lead-Free Solders and Cu-xZn Alloys
Yee-Wen Yen
William Yu
Guan-Da Chen
TMS2018 Phase Stability in Electronic Materials 13 August 2018 Pages: 170 - 181
Part of 1 collection:

TMS2018 Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
Phase-Field Study of Electromigration-Induced Shape Evolution of a Transgranular Finger-Like Slit
Jay Santoki
Arnab Mukherjee
Britta Nestler
TMS2018 Phase Stability in Electronic Materials 31 August 2018 Pages: 182 - 193
Part of 1 collection:

TMS2018 Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
Fabrication of Aluminum Nitride Thermal Substrate and Low-Temperature Die-Bonding Process for High Power LED
Pai-Jung Chang
Yue-Kai Tang
C. Y. Liu
TMS2018 Phase Stability in Electronic Materials 10 October 2018 Pages: 194 - 200
Part of 1 collection:

TMS2018 Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
A Brief Review on High-Temperature, Pb-Free Die-Attach Materials
Hongwen Zhang
Jonathan Minter
Ning-Cheng Lee
ReviewPaper 08 October 2018 Pages: 201 - 210
Thermoelectric Coolers (TECs): From Theory to Practice
Tamer Guclu
Erdem Cuce
ReviewPaper 30 October 2018 Pages: 211 - 230
Conductive Ink Prepared by Microwave Method: Effect of Silver Content on the Pattern Conductivity
Tinghao Du
Chengli Tang
Chuncheng Zuo
BriefCommunication 30 October 2018 Pages: 231 - 237
Annealing Effect on the Structural, Optical and EPR Properties of UV Radiation Emitting Gd³⁺ Doped SrAl₂O₄ Host
Vijay Singh
N. Singh
V. Natarajan
BriefCommunication 05 November 2018 Pages: 238 - 243
Negative Capacitance Effect in Ag/α-In₂Se₃/CdS/CdSe/C Dual Band Stop Filters
Hazem K. Khanfar
A. F. Qasrawi
Sufyan R. Shehada
OriginalPaper 25 September 2018 Pages: 244 - 251
Enhanced Efficiency of Dye-Sensitized Solar Cells Based on Polyol-Synthesized Nickel–Zinc Oxide Composites
Moab Rajan Philip
Rupesh Babu
Hieu Pham Trung Nguyen
OriginalPaper 28 September 2018 Pages: 252 - 260
Capacitance–Resistive PEDOT:PSS Cotton Fabric Satisfied Jonscher’s Law with Index Exceeding One
Fahad Alhashmi Alamer
OriginalPaper 28 September 2018 Pages: 261 - 270
Optical and Structural Characterization of TiO-Zn-V Thin Films Synthesized Using the Sol–Gel Method
C. Solano
Julio Mass Varela
José Antonio Henao Martínez
OriginalPaper 28 September 2018 Pages: 271 - 277
Hydrothermal-Assisted Synthesis of TiO₂@NiMoO₄ Nanocomposites and Evaluation of Their Photocatalysis Properties
Raziyeh Bakhshali-Dehkordy
Zahra Aghajani
OriginalPaper 02 October 2018 Pages: 278 - 285
Dependence of the Photoluminescence of Hydrophilic CuInS₂ Colloidal Quantum Dots on Cu-to-In Molar Ratios
Chi Zhang
Yong Xia
Daoli Zhang
OriginalPaper 03 October 2018 Pages: 286 - 295
Temperature-Stable Dielectric Properties from − 56°C to 248°C in (1 − x)BaTiO₃-xBi(Mg_0.5Sn_0.5)O₃ System
Xiaoxia Li
Xiuli Chen
Jie Sun
OriginalPaper 04 October 2018 Pages: 296 - 303
Development of SnS_0.4Se_0.6 Ternary Alloy on Annealing of Thermally Deposited Films
Arun Banotra
Naresh Padha
OriginalPaper 04 October 2018 Pages: 304 - 311
Quantitative Correlation between Electrical Resistivity and Microhardness of Cu-Ni-Mo Alloys via a Short-Range Order Cluster Model
Hongming Li
Chuang Dong
Dayu Zhou
OriginalPaper 04 October 2018 Pages: 312 - 320
Spin-Polarized Transport Behavior Induced by Asymmetric Edge Hydrogenation in Hybridized Zigzag Boron Nitride and Graphene Nanoribbons
Lihua Wang
Bingjun Ding
Yong Guo
OriginalPaper 04 October 2018 Pages: 321 - 328
Structural Design of Near-Infrared Light-Active Cu/TiO₂/NaYF₄:Yb,Er Nanocomposite Photocatalysts
Duong Van Hau
Dang Thi Thanh Nhan
Nguyen Duc Cuong
OriginalPaper 08 October 2018 Pages: 329 - 336
Effect of Structure on the Electronic, Magnetic and Thermal Properties of Cubic Fe₂Mn_xNi_1−xSi Heusler Alloys
S. Noui
Z. Charifi
Ş. Uğur
OriginalPaper 08 October 2018 Pages: 337 - 351
Effect of Thermal Annealing on the Electrical Properties of Inverted Organic Solar Cells Based on PCDTBT: PC₇₀BM Nanocomposites
Asya Mhamdi
Fatma Ben Slama Sweii
Abdelaziz Bouazizi
OriginalPaper 08 October 2018 Pages: 352 - 357
Influence of Ba²⁺ on Opto-Electric Properties of Nanocrystalline BiFeO₃ Multiferroic
Mahendra V. Shisode
Ashok V. Humbe
K. M. Jadhav
OriginalPaper 08 October 2018 Pages: 358 - 367
Anomalous Magnetic Properties of Tb/Cr/Ta Film Above Curie Temperature
Zhiwei Jiao
Yi Yang
Weidi Jiang
OriginalPaper 10 October 2018 Pages: 368 - 373
Densification and Mechanical Properties of YAG Ceramics Fabricated by Air Pressureless Sintering
Huanzhe Tong
Nengli Wang
Xiyan Zhang
OriginalPaper 10 October 2018 Pages: 374 - 385
The Study of Microstructure, Dielectric and Multiferroic Properties of (1 − x) Co_0.8Cu_0.2Fe₂O₄-xBa_0.6Sr_0.4TiO₃ Composites
Ruicheng Xu
Shilong Zhang
Chunlin Fu
OriginalPaper 10 October 2018 Pages: 386 - 400
Photocatalytic Performance of SnO₂:Mo Nanopowders Against the Degradation of Methyl Orange and Rhodamine B Dyes Under Visible Light Irradiation
N. Manjula
G. Selvan
A. R. Balu
OriginalPaper 11 October 2018 Pages: 401 - 408
Solution Combustion Synthesis of BiFeO₃ Powders Using CTAB as Fuel
N. Asefi
M. Hasheminiasari
S. M. Masoudpanah
OriginalPaper 12 October 2018 Pages: 409 - 415
High Thermoelectric Figure of Merit in p-Type (Bi₂Te₃)_x − (Sb₂Te₃)_1−x Alloys Made from Element-Mechanical Alloying and Spark Plasma Sintering
Babu Madavali
Hyo-Seob Kim
Soon-Jik Hong
OriginalPaper 15 October 2018 Pages: 416 - 424
Synthesis, Characterization, and Optical, Electrical and Thermal Stabilities of Poly(phenoxy-imine)s Containing Methyl and Hydroxyl Groups
İsmet Kaya
Zekiye Fulya Yetgin
OriginalPaper 15 October 2018 Pages: 425 - 437
Electrical and Optoelectronic Properties of Chemically Prepared PbS/MnS Heterojunction
Abhijit Banerjee
OriginalPaper 15 October 2018 Pages: 438 - 444
Synthesis of SnO₂ Nanoparticles by Electrooxidation Method and Their Application in Dye-Sensitized Solar Cells: The Influence of the Counterion
Masoud Abrari
Majid Ghanaatshoar
Saied Saeed Hosseiny Davarani
OriginalPaper 15 October 2018 Pages: 445 - 453
Vapor Phase Epitaxy of (133) and (211) CdTe on (211) Si Substrates Using Metallic Cd Source
Kenji Iso
Yuya Gokudan
Akinori Koukitu
OriginalPaper 16 October 2018 Pages: 454 - 459

Volume 48, Issue 1

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