Volume 48, Issue 1, January 2019

Special Sections: TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder. Guest Editors: Kazuhiro Nogita, Fan-Yi Ouyang, Sergey A. Belyakov, Chih Chen, Christopher M. Gourlay, Kwang-Lung Lin, Won-sik Hong, Mehran Maalekian; and TMS2018 Phase Stability in Electronic Materials. Guest Editor: Shih-kang Lin

ISSN: 0361-5235 (Print) 1543-186X (Online)

In this issue (80 articles)

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    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Topical Collection

    Effects of Aspect Ratio on Microstructural Evolution of Ni/Sn/Ni Microjoints

    T. H. Yang, H. Y. Yu, Y. W. Wang, C. R. Kao Pages 9-16
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    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

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    Reaction Within Ni/Sn/Cu Microjoints for Chip-Stacking Applications

    Y. W. Wang, W. L. Shih, H. T. Hung, C. R. Kao Pages 25-31
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    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

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    Solid-State Diffusion of Bi in Sn: Effects of β-Sn Grain Orientation

    André M. Delhaise, Zhangqi Chen, Doug D. Perovic Pages 32-43
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    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

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    Co-P Diffusion Barrier for p-Bi2Te3 Thermoelectric Material

    Chun-Hsien Wang, Hsien-Chien Hsieh, Hsin-Yi Lee Pages 53-57
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    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

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    Nucleation and Growth of Tin Hillocks by In Situ Nanoindentation

    Irene Lujan-Regalado, Antony Kirubanandham Pages 58-71
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    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

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    Room Temperature Bonding on Interface Between Metal and Ceramic

    Kyu-Bong Jang, Sungwook Mhin, Sung-Chul Lim Pages 72-78
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    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

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    The Potential for Metal–Carbon Nanotubes Composites as Interconnects

    Leila Ladani Pages 92-98
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    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

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    High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders

    Che-Wei Chang, Kwang-Lung Lin Pages 135-141
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    TMS2018 Microelectronic Packaging, Interconnect, and Pb-free Solder

    Topical Collection

    Heating Rate Dependence of the Mechanisms of Copper Pumping in Through-Silicon Vias

    Hanry Yang, Tae-Kyu Lee, Lutz Meinshausen Pages 159-169
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