Volume 41, Issue 2

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February 2012

Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

22 articles in this issue

The Effect of Random Voids in the Modified Gurson Model
Huiyang Fei
Kyle Yazzie
Hanqing Jiang
OriginalPaper 01 December 2011 Pages: 177 - 183
A Model for Rapid Tin Whisker Growth on the Surface of ErSn₃ Phase
Hu Hao
Guangchen Xu
Fu Guo
OriginalPaper 02 December 2011 Pages: 184 - 189
Creep Behavior of Bi-Containing Lead-Free Solder Alloys
David Witkin
OriginalPaper 15 October 2011 Pages: 190 - 203
Whisker Formation Induced by Component and Assembly Ionic Contamination
Polina Snugovsky
Stephan Meschter
Jeffrey Kennedy
OriginalPaper Open access 19 November 2011 Pages: 204 - 223
Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging
Mike Powers
Jianbiao Pan
Patrick Hyland
OriginalPaper 22 September 2011 Pages: 224 - 231
Electrical and Mechanical Properties of Through-Silicon Vias and Bonding Layers in Stacked Wafers for 3D Integrated Circuits
Sung-Hwan Hwang
Byoung-Joon Kim
Young-Chang Joo
OriginalPaper 08 October 2011 Pages: 232 - 240
Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue
Liang Yin
Luke Wentlent
Peter Borgesen
OriginalPaper 28 September 2011 Pages: 241 - 252
Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective
Kejun Zeng
Mike Pierce
Becky Holdford
OriginalPaper 17 August 2011 Pages: 253 - 261
In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders
Bite Zhou
Thomas R. Bieler
Kuo-Chuan Liu
OriginalPaper 15 October 2011 Pages: 262 - 272
Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation
Tae-Kyu Lee
Bite Zhou
Kuo-Chuan Liu
OriginalPaper 07 October 2011 Pages: 273 - 282
The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints
Thomas R. Bieler
Bite Zhou
Kuo-Chuan Liu
OriginalPaper 16 November 2011 Pages: 283 - 301
Toward a Better Understanding of the Effect of Cu Electroplating Process Parameters on Cu₃Sn Voiding
Liang Yin
Fred Wafula
Peter Borgesen
OriginalPaper 28 September 2011 Pages: 302 - 312
Size Control and Characterization of Sn-Ag-Cu Lead-Free Nanosolders by a Chemical Reduction Process
K.C. Yung
C.M.T. Law
T.M. Yue
OriginalPaper 24 September 2011 Pages: 313 - 321
Interfacial Effects During Thermal Cycling of Cu-Filled Through-Silicon Vias (TSV)
P. Kumar
I. Dutta
M.S. Bakir
OriginalPaper Open access 10 August 2011 Pages: 322 - 335
Martensitic Transformation in Sn-Rich SnIn Solder Joints
K.-O. Lee
J.W. Morris Jr.
Fay Hua
OriginalPaper 02 December 2011 Pages: 336 - 351
Finite-Element Analysis of Current-Induced Thermal Stress in a Conducting Sphere
Ming Liu
Fuqian Yang
OriginalPaper 22 November 2011 Pages: 352 - 361
Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature
B. Arfaei
N. Kim
E.J. Cotts
OriginalPaper 19 October 2011 Pages: 362 - 374
Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions
Z. Huang
P. Kumar
R. Mahajan
OriginalPaper 01 October 2011 Pages: 375 - 389
Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints
Iver E. Anderson
Adam Boesenberg
David Hillman
OriginalPaper 28 September 2011 Pages: 390 - 397
Maximum-Entropy Principle for Modeling Damage and Fracture in Solder Joints
D. Chan
G. Subbarayan
L. Nguyen
OriginalPaper 08 December 2011 Pages: 398 - 411
Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates. II: Fracture Mechanism Map
P. Kumar
Z. Huang
R. Mahajan
OriginalPaper 17 November 2011 Pages: 412 - 424
Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique
Limin Ma
Fu Guo
Haiyan Zhao
OriginalPaper 29 December 2011 Pages: 425 - 430

Volume 41, Issue 2

The Effect of Random Voids in the Modified Gurson Model

A Model for Rapid Tin Whisker Growth on the Surface of ErSn₃ Phase

Creep Behavior of Bi-Containing Lead-Free Solder Alloys

Whisker Formation Induced by Component and Assembly Ionic Contamination

Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging

Electrical and Mechanical Properties of Through-Silicon Vias and Bonding Layers in Stacked Wafers for 3D Integrated Circuits

Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue

Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective

In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders

Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation

The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

Toward a Better Understanding of the Effect of Cu Electroplating Process Parameters on Cu₃Sn Voiding

Size Control and Characterization of Sn-Ag-Cu Lead-Free Nanosolders by a Chemical Reduction Process

Interfacial Effects During Thermal Cycling of Cu-Filled Through-Silicon Vias (TSV)

Martensitic Transformation in Sn-Rich SnIn Solder Joints

Finite-Element Analysis of Current-Induced Thermal Stress in a Conducting Sphere

Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature

Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions

Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints

Maximum-Entropy Principle for Modeling Damage and Fracture in Solder Joints

Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates. II: Fracture Mechanism Map

Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique

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