Volume 176, Issue 4

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July 2011

This issue is a translation of Matematychni Metody ta Fizyko-Mekhanichni Polya (Mathematical Methods and Physicomechanical Fields), Vol. 53, No. 1, part I, 2010

7 articles in this issue

Cauchy problem for the Fokker–Planck–Kolmogorov equation of a multidimensional normal Markovian process
S. D. Ivasyshen
H. S. Pasichnyk
OriginalPaper 23 June 2011 Pages: 505 - 514
Singular integral relations and equations for a piecewise homogeneous transversally isotropic space with interphase defects
O. F. Kryvyy
OriginalPaper 23 June 2011 Pages: 515 - 531
Green functions of three-dimensional static thermoelasticity problems for a piecewise homogeneous space
B. V. Protsyuk
OriginalPaper 23 June 2011 Pages: 532 - 547
On methods for the solution of integral equations of the theory of plasticity based on the concept of slip
M. Yu. Shvaiko
OriginalPaper 23 June 2011 Pages: 548 - 560
Axially symmetric problems of stationary heat conduction and thermoelasticity for a body with thermally active or thermally insulated disk inclusion (crack)
H. S. Kit
O. P. Sushko
OriginalPaper 23 June 2011 Pages: 561 - 577
Thermal stress state of a bimaterial with a closed interfacial crack having rough surfaces
R. M. Martynyak
OriginalPaper 23 June 2011 Pages: 578 - 589
Dynamic stresses in a compound body with circular crack under sliding contact on an interface
V. V. Mykhas’kiv
V. Z. Stankevych
N. V. Glushkova
OriginalPaper 23 June 2011 Pages: 590 - 599

Volume 176, Issue 4

Cauchy problem for the Fokker–Planck–Kolmogorov equation of a multidimensional normal Markovian process

Singular integral relations and equations for a piecewise homogeneous transversally isotropic space with interphase defects

Green functions of three-dimensional static thermoelasticity problems for a piecewise homogeneous space

On methods for the solution of integral equations of the theory of plasticity based on the concept of slip

Axially symmetric problems of stationary heat conduction and thermoelasticity for a body with thermally active or thermally insulated disk inclusion (crack)

Thermal stress state of a bimaterial with a closed interfacial crack having rough surfaces

Dynamic stresses in a compound body with circular crack under sliding contact on an interface

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