Grain growth of copper films prepared by chemical vapour deposition SA-KYUN RHAWON-JUN LEECHONG-OOK PARK OriginalPaper Pages: 217 - 221
Some optimum processing properties for anisotropic conductive adhesives for flip chip interconnection S. H MANNAND. J WILLIAMSD. C WHALLEY OriginalPaper Pages: 223 - 231
Low temperature co-fired AlN multilayer substrates WEI-GUO MIAOYIN WUHE-PING ZHOU OriginalPaper Pages: 233 - 238
Deep-level characterization in semi-insulating GaAs by photo-induced current and Hall effect transient spectroscopy K YASUTAKEH KAKIUCHIH KAWABE OriginalPaper Pages: 239 - 245
Conductive powder preparation and electrical properties of RuO2 thick film resistors KANG-MYUNG YIKI-WOONG LEEIN-SHIK LEE OriginalPaper Pages: 247 - 251
Adhesion of multilayer solder pads on silicon KWANG-LUNG LINSHIN-KUO CHENSHIUH-YUAN CHANG OriginalPaper Pages: 253 - 257
The A.C. impedance of polycrystalline CuInS2 thin films A. H EIDS MAHMOUD OriginalPaper Pages: 259 - 264
Electrical and optical characteristics of SnO2 thin films prepared by dip coating from aqueous colloidal suspensions A. E DE SOUZAS. H MONTEIROS. H PULCINELLI OriginalPaper Pages: 265 - 270
Preparation and electrical properties of semiconducting strontium—lead titanate PTCR ceramics D. J WANGZ. L GUIL. T LI OriginalPaper Pages: 271 - 276