Design of solder joints for fundamental studies on the effects of electromigration C. E. HoA. LeeK. N. Subramanian OriginalPaper 24 March 2007 Pages: 569 - 574
Electrodeposition and characterization of CdSe semiconductor thin films S. M. RashwanS. M. Abd El-WahabM. M. Mohamed OriginalPaper 30 March 2007 Pages: 575 - 585
Electrical properties of iron phthalocyanine thin film device using gold and aluminium electrodes Abraham C. VargheseC. S. Menon OriginalPaper 01 March 2007 Pages: 587 - 592
Dye-sensitized solar cell based on nanocrystalline TiO2 with 3–10 nm in diameter Jinting JiuSeiji IsodaHao Wang OriginalPaper 26 January 2007 Pages: 593 - 597
Whisker nucleation in indentation residual stress field on tin plated component leads Jin LiangZhi-Hui XuXiaodong Li OriginalPaper 10 March 2007 Pages: 599 - 604
Compositional effects on the properties of (1-x)BaTiO3-xBi0.5Na0.5TiO3 ceramics Yanqiu HuangLanfang GaoHongyan Du OriginalPaper 21 February 2007 Pages: 605 - 609
Aluminum doped ZnO by reactive sputtering of coaxial Zn and Al metallic targets M. A. Santana-ArandaA. Armenta-EstradaM. Meléndez-Lira OriginalPaper 23 January 2007 Pages: 611 - 614
Study of electrical and microstructure properties of high dielectric hafnium oxide thin film for MOS devices R. K. NaharVikram SinghAparna Sharma OriginalPaper 20 March 2007 Pages: 615 - 619
Improvement of Ge/Pd/GaAs ohmic contact by In layer Petr MacháčPetr SajdlVladimír Machovič OriginalPaper 21 February 2007 Pages: 621 - 625
Effect of frequency and current density on A.C. etching of aluminum electrolytic capacitor foil Yueh Lien LeeBin Lung OuYi Hung Chiu OriginalPaper 28 November 2006 Pages: 627 - 634
Styrene butadiene rubber/aluminum powder composites—mechanical, morphological and electrical behaviors N. M. RenukappaSiddaramaiahR. D. Sudhakar Samuel OriginalPaper 21 December 2006 Pages: 635 - 645
Piezoelectric and optical properties of ZnO thin films deposited using various O2/(Ar+O2) gas ratios Seong Jun KangYang Hee JoungKyoung Won Kim OriginalPaper 01 March 2007 Pages: 647 - 653
Interfacial adhesion of polymeric adhesive film on different surfaces in the fabrication of polymer photonic devices M. A. UddinW. F. HoHau Ping Chan OriginalPaper 13 February 2007 Pages: 655 - 663
Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures X. P. ZhangC. B. YuL. Dorn OriginalPaper 21 December 2006 Pages: 665 - 670
Ferroelectric properties of modified Ba-based perovskite compound and its solid solution with BaTiO3 S. T. SulepetkarR. L. Raibagkar OriginalPaper 11 November 2006 Pages: 671 - 675
Elimination of current non-uniformity in carbon nanotube field emitters Preeti VermaPoornendu ChaturvediP. K. Bhatnagar OriginalPaper 21 December 2006 Pages: 677 - 680