Electrical characterization of semiconductor materials and devices—review M. J. DeenF. Pascal Review Pages: 549 - 575
Creep properties of Sn-3.5Ag-0.5Cu lead-free solder under step-loading Chih-Kuang LinHsuan-Yu Teng OriginalPaper Pages: 577 - 586
Low dielectric loss and enhanced tunable properties of Cr-doped barium strontium titanate solid solution Ruxing LiJinrong ChengWenbiao Wu OriginalPaper Pages: 587 - 591
Morphological analysis of poly(o-methoxyaniline) thin-films deposited by spin coating technique John Paul H. LimaAdnei M. de Andrade OriginalPaper Pages: 593 - 596
Comparative performance of gold wire bonding on rigid and flexible substrates Yu Hin ChanJang-Kyo KimMing Wai Ng OriginalPaper Pages: 597 - 606
The study of forming gas plasma on HSG-7000 silsesquioxane-based low-k dielectric film using X-ray photoelectron spectroscopy K. C. AwN. T. SalimZ. Li OriginalPaper Pages: 607 - 614
Characterization of CuAlO2 films prepared by dc reactive magnetron sputtering A. Sivasankar ReddyP. Sreedhara ReddyG. Mohan Rao OriginalPaper Pages: 615 - 620
Spin Glass transition on Fe0.6Cr0.1Al0.3 and Fe0.6Ti0.1Al0.3 K. A. Azez OriginalPaper Pages: 621 - 623
Ferroelectric polymeric PVDF films prepared by ultrasonic atomization method Yun YeYadong JiangHongjuan Zeng OriginalPaper Pages: 631 - 635
Preparation and properties of low-temperature co-fired ceramic of CaO–SiO2–B2O3 system Haikui ZhuMin LiuAnguo Lv OriginalPaper Pages: 637 - 641
Ge/Si heterojunction photodetector for 1.064 µm laser pulses Raid A. IsmailJospen KoshapaOmar A. Abdulrazaq OriginalPaper Pages: 643 - 646