Structural, mechanical, hardness indentation measurements of Sn65−x Ag25Sb10Cu x solder alloys rapidly solidified from melt at cooling rate 1.1×105 K s−1 R. M. Shalaby OriginalPaper Pages: 205 - 209
The effect of rapid solidification on the structure, decomposition behavior, electrical and mechanical properties of the Sn–Cd binary alloys Mustafa KamalAbu Bakr El-BediwiTarek El-Ashram OriginalPaper Pages: 211 - 217
Comparison of low-melting lead-free solders in tensile properties with Sn–Pb eutectic solder Ikuo ShohjiTomohiro YoshidaSusumu Hioki OriginalPaper Pages: 219 - 223
Space-charge-limited current analysis in amorphous InSe thin films K. YilmazM. ParlakÇ. Erçelebi OriginalPaper Pages: 225 - 229
Yttrium-substituted bismuth titanate (Bi4−x Y x Ti3O12) thin film for use in non-volatile memories S. W. KangS. W. Rhee OriginalPaper Pages: 231 - 234
Effect of anisotropy of tin on thermomechanical behavior of solder joints K. N. SubramanianJ. G. Lee OriginalPaper Pages: 235 - 240
Sintering condition and PTCR characteristics of porous (Ba,Sr)(Ti,Sb)O3 J.-G. KimW.-P. TaiS.-M. Lim OriginalPaper Pages: 241 - 245
Interface structure and electrical properties of PtSi/Si1−x Ge x diodes based on silicon Meicheng LiLiancheng ZhaoXuekang Chen OriginalPaper Pages: 247 - 251
Evaluation of residual stress in BaTiO3-based Ni-MLCCs with X7R characteristics Dong-Ho ParkYeon-Gil JungUngyu Paik OriginalPaper Pages: 253 - 259
Simulated thermal cycling of surface components on FR4 printed wiring boards using standard tin–lead solder K. PittG. Goldspink OriginalPaper Pages: 261 - 264
Structural and electrical conductivity studies on (M,V)-TiO2 (M=Al, Cr, Fe) rutile solid solutions at high temperature M. A. TenaM. LlusarG. Monrós OriginalPaper Pages: 265 - 270
