1. Grain growth of copper films prepared by chemical vapour deposition

   • SA-KYUN RHA
   • WON-JUN LEE
   • CHONG-OOK PARK

   OriginalPaper Pages: 217 - 221

2. Some optimum processing properties for anisotropic conductive adhesives for flip chip interconnection

   • S. H MANNAN
   • D. J WILLIAMS
   • D. C WHALLEY

   OriginalPaper Pages: 223 - 231

3. Low temperature co-fired AlN multilayer substrates

   • WEI-GUO MIAO
   • YIN WU
   • HE-PING ZHOU

   OriginalPaper Pages: 233 - 238

4. Deep-level characterization in semi-insulating GaAs by photo-induced current and Hall effect transient spectroscopy

   • K YASUTAKE
   • H KAKIUCHI
   • H KAWABE

   OriginalPaper Pages: 239 - 245

5. Conductive powder preparation and electrical properties of RuO₂ thick film resistors

   • KANG-MYUNG YI
   • KI-WOONG LEE
   • IN-SHIK LEE

   OriginalPaper Pages: 247 - 251

6. Adhesion of multilayer solder pads on silicon

   • KWANG-LUNG LIN
   • SHIN-KUO CHEN
   • SHIUH-YUAN CHANG

   OriginalPaper Pages: 253 - 257

7. The A.C. impedance of polycrystalline CuInS₂ thin films

   • A. H EID
   • S MAHMOUD

   OriginalPaper Pages: 259 - 264

8. Electrical and optical characteristics of SnO₂ thin films prepared by dip coating from aqueous colloidal suspensions

   • A. E DE SOUZA
   • S. H MONTEIRO
   • S. H PULCINELLI

   OriginalPaper Pages: 265 - 270

9. Preparation and electrical properties of semiconducting strontium—lead titanate PTCR ceramics

   • D. J WANG
   • Z. L GUI
   • L. T LI

   OriginalPaper Pages: 271 - 276