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Low Profile Packaging for MEMS Aero-acoustic Sensors

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Abstract

This paper describes a semi-automated conductive ink process used for packaging MEMS devices. The method is applied to packaging of MEMS sensors for wind tunnel testing. The primary advantage of the method is a reduction in surface topology between the package and the integrated MEMS sensors. In this paper we explore the relationship between trace dimensions, resistivity, and deposition parameters such as feed rate, tip-substrate separation and tip diameter. Using this procedure it is possible to generate interconnects between a PC board and MEMS sensor chip with a topology of less than 25 micrometers.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Tufts University, 200 College Ave., Medford, MA, 02155, USA

    John R. Burns, Robert D. White & Joshua S. Krause

Authors
  1. John R. Burns
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  2. Robert D. White
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  3. Joshua S. Krause
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Burns, J.R., White, R.D. & Krause, J.S. Low Profile Packaging for MEMS Aero-acoustic Sensors. MRS Online Proceedings Library 1415, 60–66 (2012). https://doi.org/10.1557/opl.2012.48

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  • DOI: https://doi.org/10.1557/opl.2012.48

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