Abstract
The discovery of ferroelectricity in hafnium oxide (HfO2) thin films renewed the interest in ferroelectric nonvolatile memories. In particular, not only ferroelectric capacitors but also ferroelectric field-effect transistor based on this material have now become appealing concepts. This is mainly due to robust ferroelectric properties even upon aggressive scaling and to the compatibility with common fabrication processes used in the semiconductor industry. In this chapter, we review the key achievements of HfO2-based FeFETs since their first report in 2012. First, material properties of HfO2 for memory applications are briefly summarized, discussing the impact of doping as well as the electrical switching and reliability characteristics. Then, FeFETs having a 10-nm-thick silicon-doped HfO2 layer in the gate stack are illustrated, and their main figures of merit are discussed, including memory window, write and read operations, endurance and retention aspects as well as parasitic charge trapping. Finally, the integration in advanced technology nodes and the performance of large active memory arrays is shown.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
T. Mitsui, Ferroelectrics and antiferroelectrics, in Springer Handbook of Condensed Matter and Materials Data, ed. by W. Martienssen, H. Warlimont (Springer, Heidelberg, 2005), pp. 903–938
T. Mikolajick, Ferroelectric nonvolatile memories, in Encyclopedia of Materials Science and Technology, ed. by K.H.J. Buschow, R.W. Cahn, M.C. Flemings, B. Ilschner, E.J. Kramer, S. Mahajan (Elsevier, Oxford, 2002), pp. 1–5
D.A. Buck, Ferroelectrics for digital information storage and switching, master thesis. MIT Digital Computer Laboratory (1952)
J. Merz, J.R. Anderson, Ferroelectric storage devices. Bell Lab. Rec. 33, 335–342 (1955)
J.R. Anderson, Feroelectric materials as storage elements for digital computers and switching systems. Trans. Amer. Inst. Elect. Engrs. 71, Part I: Commun. Electr. 395–401 (1953)
B. Dennard, US Patent (1968)
D. Bondurant, Ferroelectronic RAM memory family for critical data storage. Ferroelectrics 112, 273–282 (1990)
C.A. Paz de Araujo, J.D. Cuchiaro, L.D. McMillan, M.C. Scott, J.F. Scott, Fatigue-free ferroelectric capacitors with platinum electrodes. Nature 374, 627–629 (1994).
T. Mikolajick, C. Dehm, W. Hartner, I. Kasko, M.J. Kastner, N. Nagel, M. Moert, C. Mazure, FeRAM technology for high density applications. Microelectron. Reliab. 41, 947–950 (2001)
C.-U. Pinnow, T. Mikolajick, Material aspects in emerging nonvolatile memories. J. Electrochem. Soc. 151, K13–K19 (2004).
M. Röhner, T. Mikolajick, R. Hagenbeck, N. Nagel, Integration of FeRAM devices into a standard CMOS process—impact of ferroelectric anneals on CMOS characteristics. Integr. Ferroelectr. 47, 61–70 (2002)
A.K. Tagantsev, I. Stolichnov, E.L. Colla, N. Setter, Polarization fatigue in ferroelectric films: basic experimental findings, phenomenological scenarios, and microscopic features. J. Appl. Phys. 90, 1387–1402 (2001)
K. Maruyama, M. Kondo, S.K. Singh, H. Ishiwara, New ferroelectric material for embedded FRAM LSIs. Fujitsu Sci. Tech. J. 43, 502–507 (2007)
J.-M. Koo, B.-S. Seo, S. Kim, S. Shin, J.-H. Lee, H. Baik, J.-H. Lee, J.H. Lee, B.-J. Bae, J.-E. Lim, D.-C. Yoo, S.-O. Park, H.-S. Kim, H. Han, S. Baik, J.-Y. Choi, Y. J. Park, Y. Park, Fabrication of 3D trench PZT capacitors for 256Mbit FRAM device application. IEDM Techn. Digest. 340–343 (2005)
H.P. McAdams, R. Acklin, T. Blake, X.-H. Du, J. Eliason, J. Fong, W.F. Kraus, D. Liu, S. Madan, T. Moise, S. Natarajan, N. Qian, Y. Qiu, K.A. Remack, J. Rodriguez, J. Roscher, A. Seshadri, S.R. Summerfelt, A 64-Mb embedded FRAM utilizing a 130 nm 5LM Cu/FSG logic process, IEEE J. Solid-St. Circ. 39, 667–677 (2004)
I.M. Ross, Semiconductive translating device, U.S. patent 2791760 A (1957)
J.L. Moll, Y. Tarui, IEEE Trans. Electron Devices 10, 338 (1963)
T.P. Ma, J.-P. Han, Why is nonvolatile ferroelectric memory field-effect transistor still elusive? IEEE Electron Device Lett. 23, 386–388 (2002)
S. Sakai, R. Ilangovan, Metal–ferroelectric–insulator–semiconductor memory FET with long retention and high endurance. IEEE Electron Device Lett. 25, 369–371 (2004)
T.S. Boescke, J. Mueller, D. Braeuhaus, U. Schroeder, U. Boettger, Ferroelectricity in hafnium oxide thin films. Appl. Phys. Lett. 99, 102903 (2011)
X. Sang, E.D. Grimley, T. Schenk, U. Schroeder, J. M. LeBeau, Appl. Phys. Lett. 106, 162905 (2015)
International technology roadmap for semiconductors, emerging research devices (2013/14) http://www.itrs.net
M.T. Bohr, R.S. Chau, T. Ghani, K. Mistry, IEEE Spectr. 44, 29 (2007)
M. Trentzsch et al., A 28 nm HKMG super low power embedded NVM technology based on ferroelectric FETs. IEEE Int. Electron Devices Meeting (IEDM), 11.5.1–11.5.4 (2016)
S. Dünkel et al., A FeFET based super-low-power ultra-fast embedded NVM technology for 22 nm FDSOI and beyond. IEEE Int. Electron Devices Meeting (IEDM), 19.7.1–19.7.4 (2017)
F.M. Spiridonov, L.N. Komissarova, A.G. Kocharov, V.I. Spitsyn, Russ. J. Inorg. Chem. 14, 1332 (1969)
C. Richter, T. Schenk, M.H. Park, F. Tscharntke, E.D. Grimley, J.M. LeBeau, C. Zhou, C.M. Fancher, J.L. Jones, T. Mikolajick, U. Schroeder, Adv. Electron. Mater. 3, 1700131 (2017)
M. Hoffmann, U. Schroeder, T. Schenk, T. Shimizu, H. Funakubo, O. Sakata, D. Pohl, M. Drescher, C. Adelmann, R. Materlik, A. Kersch, T. Mikolajick, J. Appl. Phys. (2015) accepted
D. Martin, J. Müller, T. Schenk, T. M. Arruda, A. Kumar, E. Strelcov, E. Yurchuk, S. Müller, D. Pohl, U. Schroeder, S. V. Kalinin, T. Mikolajick; Adv. Mat. 26(48), 8198–8202 (2014)
I. Stolichnov, M. Cavalieri, E. Colla, T. Schenk, T. Mittmann, T. Mikolajick, U. Schroeder, A.M. Ionescu, ACS Appl. Mater. Interfaces 2018.
M.H. Park, T. Schenk, U. Schroeder, Dopants in atomic layer deposited HfO2 thin films, Chapter 3.1, in Ferroelectricity in Doped Hafnium Oxide: Materials Properties and Devices (Elsevier, Amsterdam, 2019)
F.P.G. Fengler, R. Nigon, P. Muralt, E.D. Grimley, X. Sang, V. Sessi, R. Hentschel, J.M. LeBeau, T. Mikolajick, U. Schroeder, Adv. Electron. Mater. 1700547 (2018)
M. Pešic´, F.P.G. Fengler, L. Larcher, A. Padovani, T. Schenk, E.D. Grimley, X. Sang, J.M. LeBeau, S. Slesazeck, U. Schroeder, T. Mikolajick, Adv. Funct. Mater, 26, 4601–4612 (2016)
U. Schroeder, E. Yurchuk, J. Müller, D. Martin, T. Schenk, P. Polakowski, C. Adelmann, M.I. Popovici, S.V. Kalinin, T. Mikolajick, Jpn. J. Appl. Phys. 53, 08LE02 (2014)
S. Clima, D. Wouters, C. Adelmann, T. Schenk, U. Schroeder, M. Jurczak, M. Pourtois, Appl. Phys. Lett. 104, 092906 (2014)
P. Polakowski, J. Müller, Ferroelectricity in undoped hafnium oxide. Appl. Phys. Lett. 106, 232905 (2015). https://doi.org/10.1063/1.4922272
T. Mittmann et al., Origin of ferroelectric phase in undoped HfO2 films deposited by sputtering. Adv. Mater. Interfaces (accepted).
J.F. Scott, Ferroelectric Memories (Springer, Berlin, 2000)
U. Schroeder, S. Mueller, J. Mueller, E. Yurchuk, D. Martin, C. Adelmann, T. Schloesser, R. van Bentum, T. Mikolajick, ECS J. Solid State Sci. Technol. 2(4) N69–N72 (2013)
S. Müller, S.R. Summerfelt, J. Müller, U. Schroeder, T. Mikolajick, Ten-nanometer ferroelectric Si:HfO2 films for next-generation FRAM capacitors. IEEE Electron Device Lett. 33, 1300–1302 (2012)
A.G. Chernikova, D.S. Kuzmichev, D.V. Negrov, M.G. Kozodaev, S.N. Polyakov, A.M. Markeev, Ferroelectric properties of full plasma-enhanced ALD TiN/La:HfO2/TiN stacks. Appl. Phys. Lett. 108, 242905 (2016)
T. Schenk, M. Hoffmann, J. Ocker, M. Pešić, T. Mikolajick, U. Schroeder, Adv. Funct. Mat. submitted.
M. Pesic, S. Slesazeck, T. Schenk, U. Schroeder, T. Mikolajick, E-MRS conference. Lille (2015).
J. Knoch, S. Mantl, S. Feste; Chapter on HKMG/FeFET devices, in Nanoelectronics and Information Technology, ed. by R. Waser, 3rd edn. (Wiley VCH, 2012).
H.-T. Lue, C.-J. Wu, T.-H.. Teng, IEEE Trans. Electron Devices 49, 10 (2002)
L. Van Hai, T. Mitsue, S. Shigeki, Downsizing of ferroelectric-gate field-effect-transistors for ferroelectric-NAND flash memory cells, in Proceedings of the IMW (2011), pp. 1–4
J. Müller, T.S. Böscke, S. Müller, E. Yurchuk, P. Polakowski, J. Paul, D. Martin, T. Schenk, K. Khullar, A. Kersch, W. Weinreich, S. Riedel, K. Seidel, A. Kumar, T.M. Arruda, S.V. Kalinin, T. Schlösser, R. Boschke, R. van Bentum, U. Schröder, T. Mikolajick, Ferroelectric Hafnium Oxide: a CMOS-compatible and highly scalable approach to future ferroelectric memories. IEDM Digest Technical Papers 10.8.1–10.8.4 (2013)
E. Yurchuk, J. Müller, J. Paul, T. Schlösser, D. Martin, R. Hoffmann, S. Müller, S. Slesazeck, U. Schroeder, R. Boschke, R.V. Bentum, T. Mikolajick, IEEE Trans. Electron Devices 61, 11 (2014)
J. Müller, J. Müller, E. Yurchuk, T. Schlösser, J. Paul, R. Hoffmann, S. Müller, D. Martin, S. Slesazeck, P. Polakowski, J. Sundqvist, M. Czernohorsky, P. Kücher, R. Boschke, M. Trentzsch, K. Gebauer, U. Schroeder and T. Mikolajick, Ferroelectricity in HfO2 enables nonvolatile data storage in 28 nm HKMG, in Proceeding of IEEE Symposia on VLSI Technology, (2012), pp. 25–26
E. Yurchuk, S. Mueller, D. Martin, S. Slesazeck, U. Schroeder, T. Mikolajick, J. Müller, J. Paul, R. Hoffmann, J. Sundqvist, T. Schlösser, R. Boschke, R.V. Bentum, M. Trentzsch, in Proceedings of the IRPS (2014)
J. Muller et al., High endurance strategies for hafnium oxide based ferroelectric field effect transistor, in Non-Volatile Memory Technology Symposium (NVMTS) (2016), pp. 1–7
H. Mulaosmanovic, E.T. Breyer, T. Mikolajick, S. Slesazeck, Ferroelectric FETs with 20-nm-thick HfO2 layer for large memory window and high performance. IEEE Trans. Electron Device 66, 3828–3833 (2019)
A. Sally, Reflections on the memory wall, in Proceedings of Conference Comput. Front. (2004), p. 162
E.T. Breyer, H. Mulaosmanovic, T. Mikolajick, S. Slesazeck, Reconfigurable NAND/NOR logic gates in 28 nm HKMG and 22 nm FD-SOI FeFET technology. IEEE Int. Electron Devices Meeting (IEDM), 28.5.1–28.5.4 (2017)
H. Mulaosmanovic et al., Novel ferroelectric FET based synapse for neuromorphic systems, in Symposium on VLSI Technology, pp. T176–T177 (2017)
H. Mulaosmanovic, E. Chicca, M. Bertele, T. Mikolajick, S. Slesazeck, Mimicking biological neurons with a nanoscale ferroelectric transistor. Nanoscale, 10, 21755–21763 (2018)
Acknowledgements
The authors like to thank the FeFET team at Qimonda, Fraunhofer IPMS-CNT, GlobalFoundries, RWTH Aachen, Munich University of Applied Science, and NaMLab for their contribution to the results. This work was supported in part by the EFRE fund of the European Commission and in part by the Free State of Saxony, Germany.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2020 Springer Nature Singapore Pte Ltd.
About this chapter
Cite this chapter
Schroeder, U., Slesazeck, S., Mulaosmanovic, H., Mikolajick, T. (2020). Nonvolatile Field-Effect Transistors Using Ferroelectric-Doped HfO2 Films. In: Park, BE., Ishiwara, H., Okuyama, M., Sakai, S., Yoon, SM. (eds) Ferroelectric-Gate Field Effect Transistor Memories. Topics in Applied Physics, vol 131. Springer, Singapore. https://doi.org/10.1007/978-981-15-1212-4_4
Download citation
DOI: https://doi.org/10.1007/978-981-15-1212-4_4
Published:
Publisher Name: Springer, Singapore
Print ISBN: 978-981-15-1211-7
Online ISBN: 978-981-15-1212-4
eBook Packages: Physics and AstronomyPhysics and Astronomy (R0)