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Tension–shear interaction domain for EVA-laminated countersunk point-fixing devices

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Abstract

The present paper aims is to characterize the mechanical behavior of a new embedded point-fixing device for laminated glass for combined tension–shear load cases. This kind of support is based on the principle known as “interlayer junction” in which the anchor is bonded to the interlayer and embedded in the glass panes during the lamination process. The purposes of this innovative point-fixing device are nowadays mainly focused on interior architecture applications: e.g. balustrades, stairs, doors, elevator cars and wells, design furniture, etc., taking advantage of the beautiful aesthetic of an “all-glass” element. This is due to the fact that, contrary to traditional point-fixing bolted connections, the countersunk hole is not passing through the outer glass layer, so that the stainless steel anchor looks like embedded in the glass mass. A comprehensive experimental investigation on the load-bearing capacity under the combined action of tension and shear forces is performed by means of specifically designed test apparatus and procedure. The failure modes in the different direction of load applications are identified and discussed. Finally, in addition to the interaction domain given for combined load cases between tension and shear forces, a simplified analytical interaction expression is also proposed, intended to be used in the practical design applications.

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Notes

  1. GASP is a registered trademark of Strainoptics Inc.

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Acknowledgements

The authors would like to thank Vetreria F.lli Paci, Seregno (Italy) for the manufacturing of the samples. The cooperation in the tests execution of M. Cucchi and M. Antico from Testing Laboratory for Materials, Buildings and Civil Structures of Politecnico di Milano is also gratefully acknowledged.

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Correspondence to Marco Cervio.

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Cervio, M., Muciaccia, G. & Rosati, G. Tension–shear interaction domain for EVA-laminated countersunk point-fixing devices. Glass Struct Eng 3, 77–86 (2018). https://doi.org/10.1007/s40940-018-0056-y

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  • DOI: https://doi.org/10.1007/s40940-018-0056-y

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