Skip to main content
SpringerLink
Log in

Design and performance test of miniature capillary pumped loop for electronics cooling

  • Published:
Journal of Central South University of Technology Aims and scope Submit manuscript

Abstract

Considering two characteristics of compact heat dissipation room and high heat flux, a novel miniature capillary pumped loop (MCPL) for electronics cooling was proposed. MCPL consists of evaporator, condenser, vapor and liquid line dissipates heat by boiling and condensation of working fluids with no extra power consumption. Working fluid circulation is ensured by vapor pressure and capillary head. Saturated wick screens vapor and liquid, and ensures one-way flow of working fluid with no extra valve. In order to promote heat dissipation capacity of MCPL, the intensified boiling and condensation structures are embedded into evaporator and condenser respectively, which are useful to increasing boiling and condensation efficiency. Startup and run characteristics are tested by experiments in the condition of different power inputs and working fluids. MCPL is capable of dissipating 80 W of thermal energy and keeping the bottom substrate temperature of evaporator at 80 °C.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. BAR-COHEN A. Thermal management of microelectronics in the 21st century [C]// Proceedings of the 1st Electronic Packaging Technology Conference. Singapore, 1997: 29–33.

  2. LI H Y, CHEN K Y. Thermal performance of plate-fin heat sinks under confined impinging jet conditions [J]. International Journal of Heat and Mass Transfer, 2007, 50(9/10): 1963–1970.

    Article  Google Scholar 

  3. KIM K S, WON M H, KIM J W, BACK B J. Heat pipe cooling technology for desktop PC CPU [J]. Applied Thermal Engineering, 2003, 23(9): 1137–1144.

    Article  Google Scholar 

  4. CHEIN R Y, HUANG G M. Thermoelectric cooler application in electronic cooling [J]. Applied Thermal Engineering, 2004, 24(14/15): 2207–2217.

    Article  Google Scholar 

  5. ZHAO C Y, LU T J. Analysis of microchannel heat sinks for electronics cooling [J]. International Journal of Heat and Mass Transfer, 2002, 45(24): 4857–4869.

    Article  MATH  Google Scholar 

  6. KERCHER D S, LEE J B, BRAND O, ALLEN M G, GLEZER A. Microjet cooling devices for thermal management of electronics [J]. IEEE Transactions on Components and Packing Technologies, 2003, 26(2): 359–366.

    Article  Google Scholar 

  7. FABBRI M, JIANG S J, DHIR V K. A comparative study of cooling of high power density electronics using sprays and microjets [J]. Journal of Heat Transfer-Transactions of the ASME, 2005, 127(1): 38–48.

    Article  Google Scholar 

  8. MAYDANIK Y F. Loop heat pipes [J]. Applied Thermal Engineering, 2005, 25(5/6): 635–657.

    Article  Google Scholar 

  9. MAYDANIK Y F, VERSHININ S V, KORUKOV M A, OCHTERBECK J M. Miniature loop heat pipes-A promising means for cooling electronics [J]. IEEE Transactions on Components and Packing Technologies, 2005, 28(2): 290–295.

    Article  Google Scholar 

  10. LI Qiang, CHEN Xiao-bo, QIAN Ji-yu, XUAN Yi-min. Experimental investigation of startup and steady run characteristics of miniature CPL [J]. Progress in Natural Science, 2006, 16(9): 1186–1190. (in Chinese)

    Article  Google Scholar 

  11. WANG G H, MISHKINIS D, NIKANPOUR D. Capillary heat loop technology: Space applications and recent Canadian activities [J]. Applied Thermal Engineering, 2008, 28(4): 284–303.

    Article  Google Scholar 

  12. CHEN P C, LIN W K. The application of capillary pumped loop for cooling of electronic components [J]. Applied Thermal Engineering, 2001, 21(17): 1739–1754.

    Article  Google Scholar 

  13. LIN W G, CHEN S W. Investigation on the application of miniature CPL for electronic cooling in notebook computer [J]. Journal of Engineering Thermophysics, 2002, 23(5): 602–604

    Google Scholar 

  14. PASTUKHOV V G, MAIDANIK Y F, VERSHININ C V, KORUKOV M A. Miniature loop heat pipes for electronics cooling [J]. Applied Thermal Engineering, 2003, 23(9): 1125–1135.

    Article  Google Scholar 

  15. TSAI M C, YU C S, KANG S W. Flat plate loop heat pipe with a novel evaporator structure [C]// Proceedings of 21st Annual IEEE Semiconductor Thermal Measurement and Management Symposium. San Jose, CA, 2005: 187–190.

  16. LIN H W, LIN W K. An axial heat transfer analytical model for capillary-pumped loop vapor line temperature distributions [J]. Applied Thermal Engineering, 2007, 27(11/12): 2086–2094.

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. School of Mechanical Engineering, South China University of Technology, Guangzhou, 510640, China

    Zhen-ping Wan  (万珍平), Yong-qing Fu  (付永清) & Yong Tang  (汤 勇)

  2. School of Chemical Engineering, South China University of Technology, Guangzhou, 510640, China

    Pi-hui Pi  (皮丕辉)

Authors
  1. Zhen-ping Wan  (万珍平)
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Pi-hui Pi  (皮丕辉)
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Yong-qing Fu  (付永清)
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Yong Tang  (汤 勇)
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Zhen-ping Wan  (万珍平).

Additional information

Foundation item: Project(50605023) supported by the National Natural Science Foundation of China

Rights and permissions

Reprints and permissions

About this article

Cite this article

Wan, Zp., Pi, Ph., Fu, Yq. et al. Design and performance test of miniature capillary pumped loop for electronics cooling. J. Cent. South Univ. Technol. 15 (Suppl 2), 235–239 (2008). https://doi.org/10.1007/s11771-008-0463-3

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11771-008-0463-3

Key words

Search

Navigation