Abstract
Alloy gold deposits which are used widely as contact materials in the electronics industry are shown to have complex microstructures. The existence of ultra-fine grain sizes and polymer inclusions may be responsible for the improved wear behaviour of these coatings.
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S. J. Harris, E. C. Darby, K. Bridger and A. E. Mason, to be published
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Harris, S.J., Darby, E.C. Gold-cobalt electrodeposits. Gold Bull 9, 81–83 (1976). https://doi.org/10.1007/BF03215409
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DOI: https://doi.org/10.1007/BF03215409