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Water cooling characteristics in an enclosed vacuum tank by water driven ejector

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Abstract

The general cooling tower is a device for cooling water in industrial condensers or heat exchangers. The present cooling towers have defects with noises, complicated structures and environmental problems. This paper focuses on a new water cooling system using the latent heat of evaporation in an enclosed vacuum tank and a water driven ejector system. Several experiments were carried out to improve high vacuum pressure and water cooling characteristics. The ejector performance was tested with various water temperatures. Based on the vacuum pressure of the water driven ejector, the water cooling characteristics were investigated for the condensed and vaporized air and the effect of increased evaporating surface area in an enclosed tank.

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Abbreviations

A :

Cotton area [m2]

L :

Tank volume [L]

P :

Pressure [mmHg. abs.]

Q :

Flow rate [L/min,]

RT :

Refrigeration Tonnage

T :

Temperature [°C]

A :

Air in enclosed tank

hc :

Heat exchanger for condensing

he :

Heat exchanger for ejector water

in :

Initial value

E :

Ejector

p :

Ejector pump

r :

Area ratio

T :

Enclosed tank

w :

Water in enclosed tank

Refference

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Author information

Authors and Affiliations

  1. School of Mechanical & Aerospace Engineering, Institute of Marine Industry, Gyeongsang National University, 650-160, Gyeongnam, Korea

    Hyo Min Jeong & Han Shik Chung

  2. Boo 1, Kaong Plant Co., Ltd., 6 Floor, Hwoiwon Credit Union B/D, 670-6, Hwoiwon-Dong, Masan, Gyeongnam, Korea

    Kang Youl Bae

  3. Graduate School, Department of Mechanical and Precision Engineering, Gyeongsang National University, 650-160, Gyeongnam, Korea

    Se Hyun Kim & You Sik Shin

Authors
  1. Hyo Min Jeong
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  2. Han Shik Chung
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  3. Kang Youl Bae
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  4. Se Hyun Kim
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  5. You Sik Shin
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Corresponding author

Correspondence to Han Shik Chung.

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Jeong, H.M., Chung, H.S., Bae, K.Y. et al. Water cooling characteristics in an enclosed vacuum tank by water driven ejector. J Mech Sci Technol 19, 164–172 (2005). https://doi.org/10.1007/BF02916115

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  • DOI: https://doi.org/10.1007/BF02916115

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