Structural Testing of Multichip Module SoC Components

Abstract

In modern VLSI, the testing of manufactured VLSI chips is as important as the whole process of designing and manufacturing. The structural testing plays an important role as the functional testing. Structural testing, unlike functional testing, involves testing of all the physical connections, macros, other functional blocks in the SoC (System on chip). In the structural testing of SoC boundary Scan standards (IEEE 1149.1, IEEE 1687, and IEEE 1500) are used. The complete testing of SoC can be achieved by testing the individual components of the SoC. In case of multichip module SoC, the testing can be done at the complete SoC level as well as at the chip level. In this paper, the structural testing of one of the unique component of the SoC “Fuse Macro” is explained.