Skip to main content

Low-Power Analog Bus for System-on-Chip Communication

  • Conference paper
  • First Online:
Innovations in Computer Science and Engineering

Part of the book series: Advances in Intelligent Systems and Computing ((AISC,volume 413))

  • 870 Accesses

Abstract

At present, performance and efficiency of a system-on-chip (SoC) design depends significantly on the on-chip global communication across various modules on the chip. System-on-chip communication is generally implemented using a bus architecture that runs very long distances and covers significant area of the integrated circuit. The difficult challenges in design of a large SoC such as one containing many processor cores include routing complexity, power dissipation, hardware area, latency, and congestion of the communication system. This paper proposes an analog bus for digital data. In this scheme, it replaces ‘n’ wires of an ‘n’-bit digital bus carrying data between cores with just one (or a few) wire(s) carrying analog signal(s) encoding ‘2n’ voltage levels. This analog bus uses digital-to-analog converter (DAC) drivers and analog-to-digital converter (ADC) receivers. This on-chip communication proposal can potentially save power and area. Diminution in the number of wire lines saves chip area and the reduction in total intrinsic wire capacitance consequently reduces the power consumption of the bus. The scheme should also reduce signal interference and cross-talk by eliminating the need for multiple line drivers and buffers. In spite of over-heads of the ADCs and DACs, this scheme provides significant power saving. Linear technology SPICE simulations show that the ratio of the power of the bus consumed by the proposed analog scheme to a typical digital scheme (without bus encoding or differential signalling) is given by Panalog/Pdigital = 1/(3n) where ‘n’ is the width of the bus.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 219.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 279.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. J. Cong, “An Interconnect-centric Design Flow for Nanometer Technologies,” Proc. IEEE,vol. 89, no. 4, 2001, pp. 505–528.

    Google Scholar 

  2. S. Pasricha and N. Dutt, On-Chip Communication Architectures: System on Chip Interconnect. Morgan Kaufmann, 2010.

    Google Scholar 

  3. G. E. Moore, “Lithography and the Future of Moore’s Law,” Proc. SPIE, vol. 2437, May 1995, pp. 2–17.

    Google Scholar 

  4. D. Ingerly, A. Agrawal, R. Ascazubi, A. Blattner, M. Buehler, V. Chikarmane, B. Choudhury,F. Cinnor, C. Ege, C. Ganpule, et al., “Low-k Interconnect Stack with Metal-Insulator-Metal Capacitors for 22 nm High Volume Manufacturing,” in Proc. IEEE International Interconnect Technology Conf., 2012, pp. 1–3.

    Google Scholar 

  5. A. D. Singh, “Four-valued Interface Circuits for NMOS VLSI,” International Journal of Electronics,vol. 63, no. 2, 1987, pp. 269–279.

    Google Scholar 

  6. Semiconductor Industry Association, “International Technology Roadmap for Semiconductors,” 2012.

    Google Scholar 

  7. “A Comparison of Network-on-chip and Buses,” White Paper, Arteris, SA, 2005.

    Google Scholar 

  8. L. Benini, G. De Micheli, E. Macii, M. Poncino and S. Quer, “Power Optimization of Core-Based Systems by Address Bus Encoding,” IEEE Trans. Very Large Scale Integration Systems, vol. 6, no. 4, 1998, pp. 554–562.

    Google Scholar 

  9. R. Ho, K. Mai and M. Horowitz, “Efficient on-chip global interconnects,” in IEEE Symp. onVLSI Circuits, 2003, pp. 271–274.

    Google Scholar 

  10. A. Kedia, “Design of a Serialized Link for On-chip Global Communication,” Master’s thesis, University of British Columbia, Canada, 2006.

    Google Scholar 

  11. B. Cordan, “An Efficient Bus Architecture for System-on-Chip Design“, in Proc. IEEE CustomIntegrated Circuits Conf., 1999, pp. 623–626.

    Google Scholar 

  12. http://www.itrs.net/Links/2012ITRS/Home2012.htm.

  13. T. Bjerregaard and S. Mahadevan, “A Survey of Research and Practices of Network-on-Chip,”ACM Computing Surveys, vol. 38, Issue 1, 2006, Article No.1.

    Google Scholar 

  14. A. Kedia and R. Saleh, “Power Reduction of On-Chip Serial Links,” in IEEE International Symp. Circuits and Systems, 2007, pp. 865–868.

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Venkateswara Rao Jillella .

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2016 Springer Science+Business Media Singapore

About this paper

Cite this paper

Jillella, V.R., Parvataneni, S.R. (2016). Low-Power Analog Bus for System-on-Chip Communication. In: Saini, H., Sayal, R., Rawat, S. (eds) Innovations in Computer Science and Engineering. Advances in Intelligent Systems and Computing, vol 413. Springer, Singapore. https://doi.org/10.1007/978-981-10-0419-3_15

Download citation

  • DOI: https://doi.org/10.1007/978-981-10-0419-3_15

  • Published:

  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-10-0417-9

  • Online ISBN: 978-981-10-0419-3

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics