Abstract
Thick film technology is a type of technology which uses conductive, resistive, and insulating pastes, deposited in patterns defined by screen printing and fused at high temperature (500–1000 °C) onto a ceramic substrate permanently. The thickness typically ranges from 5 to 20 μm. The firing has two significant factors, namely, T-t profile and air flows.
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Li, L. (2018). Introduction to Materials and Firing Parameters in Thick Film Firing. In: Conveyor Belt Furnace Thermal Processing. Springer, Cham. https://doi.org/10.1007/978-3-319-69730-7_10
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DOI: https://doi.org/10.1007/978-3-319-69730-7_10
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