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Area Estimation for Triple Modular Redundancy Field Programmable Gate Arrays

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Book cover Intelligent Data Analysis and Applications (ECC 2016)

Part of the book series: Advances in Intelligent Systems and Computing ((AISC,volume 535))

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Abstract

SRAM-based FPGAsare more vulnerable to single-event, particularly the single-event upset (SEU). Triple modular redundancy (TMR) protection method is a good method to prevent the FPGA system from being destroyed. At the same time, the area cost of an FPGA project plays an important role in designing an FPGA system. What’s more, the protection method can enlarge the area cost, it may exceed the maximum of the FPGAs. So we should know the changes of area when the project is protected. This article firstly discusses a new way to estimate the area of an FPGA project, which is based on its used resources, such as Look-Up-Table (LUT), Brams, IO and so on. Then, we offer the model to estimate the new area cost of the project when it’s protected by TMR. At last, we apply TMR Tool to verify the models and the results are sound.

This work was supported by the National Natural Science Foundation of China under Grants No. 61571346 and No. 61305041.

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References

  1. Legat, U., Biasizzo, A., Novak, F.: SEU recovery mechanism for SRAM-based FPGAs. IEEE Trans. Nucl. Sci. 59(5), 2562–2571(2012)

    Google Scholar 

  2. Bidokhti, N.: SEU concept to reality (allocation, prediction, mitigation). In: Reliability & Maintainability Symposium, pp. 1–5. IEEE (2010)

    Google Scholar 

  3. Single-Event Upset Mitigation for Xilinx FPGA Block Memories. http://www.xilinx.com/support/documentation/application_notes/xapp962.pdf

  4. Samudrala, P.K., Ramos, J., Katkoori, S.: Selective triple modular redundancy (STMR) based single-event upset (SEU) tolerant synthesis for FPGAs. IEEE Trans. Nucl. Sci. 51(5), 2957–2969(2014)

    Google Scholar 

  5. Matsumoto, K., Uehara, M., Mori, H.: Stateful TMR for transient faults, world automation congress (WAC), pp. 1–6. IEEE (2010)

    Google Scholar 

  6. Lam, S.K., Srikanthan, T.: Estimating area costs of custom instructions for FPGA-based Reconfigurable Processors. J. 89–94 (2007)

    Google Scholar 

  7. XinlinxVirtex-4SeriesFPGAs. http://china.xilinx.com/publications/matrix/virtex4_color.pdf

  8. Virtex-4 FPGA Configuration User Guide, Xilinx Inc.UG071, ver. 1.10 (2008)

    Google Scholar 

  9. Quinn, H., Morgan, K., Graham, P., et al.: Domain crossing errors: limitations on single device triple-modular redundancy circuits in xilinx FPGAs. IEEE Trans. Nucl. Sci. 54(6), 2037–2043 (2008)

    Article  Google Scholar 

  10. Xilinx TRMTool User Guide: TMRTool Software Version 9.2i, Xilinx Inc, UG156, ver. 2.2 (2009)

    Google Scholar 

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Correspondence to Hongjie He .

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He, H., Guo, B., Yan, Y. (2017). Area Estimation for Triple Modular Redundancy Field Programmable Gate Arrays. In: Pan, JS., Snášel, V., Sung, TW., Wang, X. (eds) Intelligent Data Analysis and Applications. ECC 2016. Advances in Intelligent Systems and Computing, vol 535. Springer, Cham. https://doi.org/10.1007/978-3-319-48499-0_30

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  • DOI: https://doi.org/10.1007/978-3-319-48499-0_30

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-48498-3

  • Online ISBN: 978-3-319-48499-0

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