Abstract
An advanced system based on a fiber Bragg grating (FBG) sensor is proposed to characterize the comprehensive viscoelastic properties of epoxy molding compound (EMC). The FBG sensor is embedded in the center of a cylindrical EMC specimen, and the strain of the EMC is measured as a function of time under a constant loading condition. The constant loading condition is achieved by utilizing an automated gas pressure system. Two loading conditions are considered: compressive pressure for the Young’s modulus and hydrostatic pressure for the Bulk modulus. The constant loadings are repeated at different temperatures. The time dependent properties at different temperatures are shifted and overlapped to create the master curves of the Young’s modulus and bulk modulus. A piece-wise shift function is developed to fit the shift factors with extreme non-linearity. The results confirm the TRS assumption about the EMC; i.e., a single set of the shift factors can be used for both Young’s modulus and bulk modulus. The comprehensive properties are used to predict the behavior of an EMC/chip bi-material joint subjected to the thermo-mechanical loadings. The results clearly show enhanced modeling predictability.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Srikanth, N.: Warpage analysis of epoxy molded packages using viscoelastic based model. J. Mater. Sci. 41, 3773–3780 (2006)
Tsai, M.-Y., Chen, Y.-C., Lee, S.R.: Correlation between measurement and simulation of thermal warpage in PBGA with consideration of molding compound residual strain. IEEE Trans. Compon. Packag. Technol. 31, 683–690 (2008)
Croll, S.G.: Residual stress in a solventless amine-cured epoxy coating. J. Coat. Technol. 51, 49–55 (1979)
Shh, S., Krguller, M., Sarigaphuti, M.: Effects of shrinkage-reducing admixtures on restrained shrinkage cracking of concrete. ACI Mater. J. 89(3), 289–295 (1992)
Ernst, L., Zhang, G., Jansen, K., Bressers, H.: Time-and temperature-dependent thermo-mechanical modeling of a packaging molding compound and its effect on packaging process stresses. J. Electron. Packag. 125, 539–548 (2003)
Chen, D.-L., Yang, P.-F., Lai, Y.-S.: A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation. Microelectron. Reliab. 52, 541–558 (2012)
Brinson, H.F., Brinson, L.C.: Polymer Engineering Science and Viscoelasticity. Springer, New York (2008)
de Vreugd, J., Jansen, K., Xiao, A., Ernst, L., Bohm, C., Kessler, A., Preu, H., Stecher M.: Advanced viscoelastic material model for predicting warpage of a QFN panel. In: 58th Electronic Components and Technology Conference, ECTC 2008, pp. 1635–1640 (2008)
O’Brien, D.J., Sottos, N., White, S.R.: Cure-dependent viscoelastic Poisson’s ratio of epoxy. Exp. Mech. 47, 237–249 (2007)
Wang, Y., Woodworth, L., Han, B.: Simultaneous measurement of effective chemical shrinkage and modulus evolutions during polymerization. Exp. Mech. 51, 1155–1169 (2011)
Sun, Y., Wang, Y., Jang, C., Han, B., Choi, K.: Generalized hybrid modeling to determine chemical shrinkage and modulus evolutions at arbitrary temperatures. Exp. Mech. 53, 1783–1790 (2013)
Sun, Y., Wang, Y., Kim, Y., Han, B.: Dual-configuration fiber Bragg grating sensor technique to measure coefficients of thermal expansion and hygroscopic swelling. Exp. Mech. 54, 593–603 (2014)
Sun, P., Leung, V.-K., Xie, B., Ma, V., Shi, D.-Q. Warpage reduction of package-on-package (PoP) module by material selection and process optimization. In: International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008, pp. 1–6 (2008)
Karalekas, D., Cugnoni, J., Botsis, J.: Monitoring of process induced strains in a single fibre composite using FBG sensor: a methodological study. Compos. Part A Appl. Sci. Manuf. 39, 1118–1127 (2008)
Sun, Y., Han, B., Parsa, E., Dasgupta, A.: Measurement of effective chemical shrinkage and equilibrium modulus of silicone elastomer used in potted electronic system. J. Mater. Sci. 49, 8301–8310 (2014)
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2017 The Society for Experimental Mechanics, Inc.
About this paper
Cite this paper
Sun, Y., Lee, HS., Han, B. (2017). Comprehensive Viscoelastic Properties Characterization of EMC Using FBG Sensor. In: Antoun, B., et al. Challenges in Mechanics of Time Dependent Materials, Volume 2. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, Cham. https://doi.org/10.1007/978-3-319-41543-7_22
Download citation
DOI: https://doi.org/10.1007/978-3-319-41543-7_22
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-41542-0
Online ISBN: 978-3-319-41543-7
eBook Packages: EngineeringEngineering (R0)