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Composite Nanowires for Room-Temperature Mechanical and Electrical Bonding

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Abstract

At millimeter dimension or less, the conventional bonding technology in electronic assembly relies heavily on reflow soldering and suffers from severe performance and reliability degradation. Meanwhile, the traditional high temperature bonding process (easily reach 220 °C) tends to result in undesired thermal damage and residual stress at the bonding interface. It is therefore a major challenge to find a means to preparing room-temperature connectors or fasteners with good mechanical and electrical bonding. Very recently, composite nanowires have been used to fabricate room-temperature fasteners. In this chapter, we summarize the state-of-the-art progress on the use of composite nanowires for room-temperature mechanical and electrical bonding. Using anodic aluminum oxide (AAO) and polycarbonate (PC) membrane as templates, the fabrication of Cu/parylene and Cu/polystyrene nanowires was described, while the fabrication of carbon nanotube (CNTs) array used to connect with Cu/parylene nanowires was also introduced. Finally, the performances of the composite nanowires (Cu/parylene, Cu/polystyrene, and CNT-Cu/parylene) used as surface fastener for room-temperature mechanical and electrical bonding were demonstrated.

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Authors and Affiliations

  1. State Key Laboratory of Multiphase Complex System, Institute of Process Engineering, Chinese Academy of Sciences, Beijing, 100190, China

    Yanbin Cui

  2. Department of Mechanical Science and Engineering, Nagoya University, Nagoya, 464-8603, Japan

    Yang Ju

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  1. Yanbin Cui
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  2. Yang Ju
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Correspondence to Yang Ju .

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  1. Dept.ofMech.&IndusEngUniversityofToronto, Mechanics&AerospaceDesignLaboratory, Toronto, Ontario, Canada

    Shaker A. Meguid

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Cui, Y., Ju, Y. (2016). Composite Nanowires for Room-Temperature Mechanical and Electrical Bonding. In: Meguid, S. (eds) Advances in Nanocomposites. Springer, Cham. https://doi.org/10.1007/978-3-319-31662-8_6

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