Abstract
In the past years, the polymeric composite materials with high thermal conductivity, low coefficient of thermal expansion (CTE), and high electrical resistance received tremendous interest in order to facilitate heat dissipation in electronic devices generated during their operation. Thermal conductivity is of significance importance for appreciable levels of thermal conductance in circuit boards, heat exchangers, appliances, and machinery. Boron nitride (BN) features high thermal conductivity and high thermal stability coupled with lightweight and moderate cost. This has fuelled research in exploring BN as suitable electrically insulating fillers to enhance thermal conductivity of polymers. In this chapter, recent developments on the thermal conductivity of BN-polymer composites are discussed. Challenges and opportunities facing BN-polymer composites are also presented.
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Mochane, M.J., Mokhena, T.C., Sefadi, J.S., Motsoeneng, T.S., Mtibe, A. (2019). Recent Advances on Thermal Conductivity of Boron Nitride-Polymer Composites. In: Hussain, C., Thomas, S. (eds) Handbook of Polymer and Ceramic Nanotechnology. Springer, Cham. https://doi.org/10.1007/978-3-030-10614-0_5-1
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