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Doping Effect on Partial-Melting of Hg x Ba2Ca2Cu3Re0.2O y Filament

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Advances in Cryogenic Engineering Materials

Part of the book series: Advances in Cryogenic Engineering ((ACRE,volume 44))

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Abstract

We have studied the fabrication of filamentary Fig system superconductor using a solution spinning method with Re addition. A controlled vapor/solid reaction process is necessary for preparing Hg-based superconductor by this method. As the F-doping resulted in a dense liquidus texture, F and Cl doping effects on partial-melting of filamentary Hg x Ba2Ca2Cu3Re0.2O y superconductor are examined to enhance the J c and to reduce the inciting temperature. A filamentary Ba2Ca2Cu3Re0.2O y precursor was spun by a solution spinning method and partially melted in an evacuated quartz tube with a pellet as a reactor. Hg1Ba1.8Ca2Cu3Re0.2(BaF2)0.2O y , Hg0.8Ba1.8Ca2Cu3Re0.2(BaF2)0.2O y , Hg1Ba2Ca2Cu2.8Re0.2(CuF2)0.2O y , Hg0.925Ba2Ca2Cu3Re0.2(HgCl2)0.075O y and Hg0.8Ba1.8Ca2Cu3Re0.2(BaF2)0.2(HgCl2)0.03O y pellets were prepared by a two-step solid state reaction method.

The partial-inelting temperature of the filamentary sample reacted with Hg1Ba2Ca2Cu2.8Re0.2(CuF2)0.2O y pellet was lower than others. The texture of the filamentary sample was dependent on the vaporizing materials. The J c of the sample was enhanced by post-annealing up to 350 °C in O2 flow. By controlling the heating condition, a high J c value more than 104 A/cm2 at 77 K and 0 T was attained for both F and Cl doped sample.

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References

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© 1998 Springer Science+Business Media New York

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Goto, T., Konishi, M., Tonomura, M. (1998). Doping Effect on Partial-Melting of Hg x Ba2Ca2Cu3Re0.2O y Filament. In: Balachandran, U.B., Gubser, D.G., Hartwig, K.T., Reed, R.P., Warnes, W.H., Bardos, V.A. (eds) Advances in Cryogenic Engineering Materials . Advances in Cryogenic Engineering, vol 44. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-9056-6_64

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  • DOI: https://doi.org/10.1007/978-1-4757-9056-6_64

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4757-9058-0

  • Online ISBN: 978-1-4757-9056-6

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