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Low Cost CAD/CAM System for Machine Parts

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Computer-Based Automation
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Abstract

A CAD/CAM system known as the MODCON(1,2,3) has shown to be useful for producing machine parts such as rocker-lever, connecting-rods, etc. In spite of the usefulness of the MODCON system, it suffers the inherent disadvantage of a batch system and therefore does not interact with a MODCON user wishing to design a machine part. An interactive CAD/CAM system is now proposed which is conceptually similar to the MODCON system. The proposed system is implemented on a microprocessors based machine which includes a central processor, a numerical data processor and another processor for I/O. This low-cost/high-power machine enables a designer to interactively design a machine part to his satisfaction before a N.C. paper tape is produced for manufacturing purpose.

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References

  1. Y. K. Chan and W. A. Knight, “MODCON: A system of the CAM for dies and moulds,” in Proc. Computer Aided Design Conference, Brighton, England, pp. 361–369, April 1980.

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  2. Y. K. Chan, “A perspective view of the MODCON system,” in Proc. 18th Design Automation Conference, Nashville, TN, pp. 179–188, June 1981.

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  3. Y. K. Chan, “Computer aided manufacturing of machine parts by volume buildings,” in Proc. Intergraphics ‘83, Tokyo, Japan, Session B3, pp. 1–19, April 1983.

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  4. I. C. Braid, “Designing with Volumes,” Cambridge University Press, 1978.

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  5. C. M. Brown, “PADL-2: A technical summary,” IEEE Computer Graphics and Applications, pp. 69–84, March 1982.

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  6. W. A. Carter, “ROMULUS - The design of a geometric modeller,” Publication p-80 CM 01 by CAM-I, Inc., November 1979.

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© 1985 Plenum Press, New York

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Ngai, W.B., Chan, Y.K. (1985). Low Cost CAD/CAM System for Machine Parts. In: Tou, J.T. (eds) Computer-Based Automation. Springer, Boston, MA. https://doi.org/10.1007/978-1-4684-7559-3_8

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  • DOI: https://doi.org/10.1007/978-1-4684-7559-3_8

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4684-7561-6

  • Online ISBN: 978-1-4684-7559-3

  • eBook Packages: Springer Book Archive

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