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Acceleration Effect

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Copper Electrodeposition for Nanofabrication of Electronics Devices

Part of the book series: Nanostructure Science and Technology ((NST))

Abstract

Fabrication of microscale and nanoscale structures can be implemented by electrodeposition of copper onto conductive templates that contain recesses in form of the desired structure. The current distribution that results from deposition from a simple acid copper solution is concentrated near the upper corners of recesses and results in incomplete filling, formation of voids, and a substantial overburden of nonfunctional material.

An erratum to this chapter can be found at http://dx.doi.org/10.1007/978-1-4614-9176-7_12

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Acknowledgments

The author acknowledges many helpful suggestions provided by Professor Edward H. Wong.

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Authors and Affiliations

  1. Department of Chemical Engineering, College of Engineering and Physical Science, Kingsbury Hall, Room W305, Durham, NH, 03824, USA

    Dale P. Barkey

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  1. Dale P. Barkey
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Correspondence to Dale P. Barkey .

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Editors and Affiliations

  1. Dept. of Chemical Engineering, Osaka Prefecture University, Osaka, Japan

    Kazuo Kondo

  2. Intel Corporation, Hillsboro, Oregon, USA

    Rohan N. Akolkar

  3. Dept. of Chemical Engineering, University of New Hampshire, Durham, New Hampshire, USA

    Dale P. Barkey

  4. Industrial Technology Support Institute, Osaka Prefecture, Japan

    Masayuki Yokoi

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Barkey, D.P. (2014). Acceleration Effect. In: Kondo, K., Akolkar, R., Barkey, D., Yokoi, M. (eds) Copper Electrodeposition for Nanofabrication of Electronics Devices. Nanostructure Science and Technology. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-9176-7_3

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