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DSP Systems Using Three-Dimensional Integration Technology

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Handbook of Signal Processing Systems

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Abstract

As three-dimensional (3D) integration technology becomes mature and starts to enter mainstream markets, it has attracted exploding interest from integrated circuit and system research community. This chapter discusses and demonstrates the exciting opportunities and potentials for digital signal processing (DSP) circuit and system designers to exploit 3D integration technology. In particular, this chapter advocates a 3D logic-DRAM integration design paradigm and discusses the use of 3D logic-memory integration in both programmable digital signal processors and application-specific digital signal processing circuits. To further demonstrate the potential, this chapter presents case studies on applying 3D logic-DRAM integration to clustered VLIW (very long instruction word) digital signal processors and application-specific video encoders. Since DSP systems using 3D integration technology is still in its research infancy, by presenting some first discussions and results, this chapter aims to motivate greater future efforts from DSP system research community to explore this new and rewarding research area.

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  1. Rensselaer Polytechnic Institute, Troy, NY, USA

    Tong Zhang, Yangyang Pan & Yiran Li

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  1. Tong Zhang
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  2. Yangyang Pan
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  3. Yiran Li
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Correspondence to Tong Zhang .

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Editors and Affiliations

  1. , Dept. of Electrical and, University of Maryland, A. V. Williams Bldg. 2311, College Park, 20742, Maryland, USA

    Shuvra S. Bhattacharyya

  2. Leiden Inst. Advanced Computer Science, Leiden Embedded Research Center, Leiden University, Niels Bohrweg 1, Leiden, 2333 CA, Netherlands

    Ed F. Deprettere

  3. Software for Systems on Silicon, RWTH Aachen University, Templergraben 55, Aachen, 52056, Germany

    Rainer Leupers

  4. , Department of Pervasive Computing, Tampere University of Technology, Korkeakoulunkatu 1, Tampere, 33720, Finland

    Jarmo Takala

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Zhang, T., Pan, Y., Li, Y. (2013). DSP Systems Using Three-Dimensional Integration Technology. In: Bhattacharyya, S., Deprettere, E., Leupers, R., Takala, J. (eds) Handbook of Signal Processing Systems. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-6859-2_26

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