Abstract
The phenolic family of adhesives are very diverse in their formulations and uses. Some are filled or modified with other polymers (vinyl, nitrile or epoxy). The composition depends largely on the intended use, e.g. for temperature and chemical resistance, or for water-proof wood bonding (phenol-resorcinol-formaldehyde). The majority are heat-curing although some wood-bonding adhesives can be cured at room temperature (RT). The comparison table includes Typical Use’ to differentiate between the types of adhesives. Phenolic adhesives are generally poorly represented by mechanical property data.
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© 1996 Chapman & Hall
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Hussey, B., Wilson, J. (1996). Phenolic Adhesives. In: Structural Adhesives. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-1203-1_21
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DOI: https://doi.org/10.1007/978-1-4613-1203-1_21
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-412-71470-2
Online ISBN: 978-1-4613-1203-1
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