Abstract
Solder reaction is the wetting of a molten solder on a solid Cu surface. Typically, when a small drop of molten solder touches a large Cu surface, it spreads and forms a cap on the Cu surface. The cap has a stable wetting angle, which is defined usually by Young’s equation for a triple point.
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References
K. N. Tu and K. Zeng, “Tin-lead (SnPb) solder reaction in flip chip technology,” Materials Science and Engineering Reports, R34, 1–58 (2001). (Review paper)
K. Zeng and K. N. Tu, “Six cases of reliability study of Pb-free solder joints in electron packaging technology,” Materials Science and Engineering Reports, R38, 55–105 (2002). (Review paper)
T. Young, Philos. Trans. R. Soc. London, 95, 65 (1805).
H. K. Kim, H. K. Liou, and K. N. Tu, “Morphology of instability of wetting tips of eutectic SnBi, eutectic SnPb, and pure Sn on Cu,” J. Mater. Res., 10, 497–504 (1995).
H. K. Kim, H. K. Liou, and K. N. Tu, “Three-dimension morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu,” Appl. Phys. Lett., 66, 2337–2339 (1995).
A. K. Larsson, L. Stenberg, and S. Liden, “Crystal structure modulation in η-Cu6Sn5,” Z. Kristallogr., 210 (11), 832–837 (1995).
H. K. Kim and K. N. Tu, “Rate of consumption of Cu soldering accompanied by ripening,” Appl. Phys. Lett., 67, 2002–2004 (1995).
C. Y. Liu and K. N. Tu, “Morphology of wetting reactions of SnPb alloys on Cu as a function of alloy composition,” J. Mater. Res., 13, 37–44 (1998).
C. Y. Liu and K. N. Tu, “Reactive flow of molten Pb(Sn) alloys in Si grooves coated with Cu film,” Phys. Rev. E, 58, 6308–6311 (1998).
F. G. Yost and A. D. Romig, Jr., in “Electronic Packaging Materials Science III,” R. Jaccodine, K. A. Jackson, and R. C. Subdahl (Eds.), Materials Research Society Symp. Proc., 108, Pittsburgh, PA (1988).
W. J. Boettinger, C. A. Handwerker, and U. R. Kattner, “Reactive wetting and intermetallic formation,” in “The Mechanics of Solder Alloy Wetting and Spreading,” F. G. Yost, F. M. Hosking, and D. R. Frear (Eds.), Van Nostrand Reinhold, New York (1993).
J. Gorlich, G. Schmidt, and K. N. Tu, “On the mechanism of the binary Cu/Sn solder reaction,” Appl. Phys. Lett., 86, 053106–1 to –3 (2005).
L. Kaufman and H. Bernstein, “Computer Calculation of Phase Diagram,” Academic Press, New York (1970).
J.-H. Shim, C.-S. Oh, B.-J. Lee, and D. N. Lee, “Thermodynamic assessment of the Cu-Sn system,” Z. Metallkd., 87, 205–212 (1996).
A. Bolcavage, C. R. Kao, S. L. Chen, and Y. A. Chang, “Thermodynamic calculation of phase stability between copper and lead-indium solder,” in Proc. Applications of Thermodynamics in the Synthesis and Processing of Materials, Oct. 2–6, 1994, Rosemont, IL, P. Nash and B. Sundman (Eds.), TMS, Warrendale, PA, pp. 171–185 (1995).
V. C. Marcotte and K. Schroeder, “Cu-Sn-Pb phase diagram,” in Proc. Thirteenth North American Thermal Analysis Society, A. R. McGhie (Ed.), North American Thermal Analysis Society, 1984, pp. 294.
H. Ohtani, K. Okuda, and K. Ishida, “Thermodynamic study of phase equilibria in the Pb-Sn-Sb system,” J. Phase Equil., 16, 416–429 (1995).
K. N. Tu, T. Y. Lee, J. W. Jang, L. Li, D. R. Frear, K. Zeng, and J. K. Kivilahti, “Wetting reaction vs. solid state aging of eutectic SnPb on Cu,” J. Appl. Phys. 89, 4843–4849 (2001).
K. N. Tu, F. Ku, and T. Y. Lee, “Morphological stability of solder reaction products in flip chip technology,” J. Electron. Mater., 30, 1129–1132 (2001).
T. Y. Lee, W. J. Choi, K. N. Tu, J. W. Jang, S. M. Kuo, J. K. Lin, D. R. Frear, K. Zeng, and J. K. Kivilahti, “Morphology, kinetics, and thermodynamics of solid state aging of eutectic SnPb and Pb-free solders (SnAg, SnAgCu, and SnCu) on Cu,” J. Mater. Res., 17, 291–301 (2002).
G. V. Kidson, “Some aspects of the growth of different layers in binary systems,” J. Nucl. Mater., 3, 21 (1961).
U. Gosele and K.N. Tu, “Growth kinetics of planar binary diffusion couples: Thin film case versus bulk cases,” J. Appl. Phys., 53, 3252 (1982).
H. K. Kim and K. N. Tu, “Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening,” Phys. Rev. B, 53, 16027–16034 (1996).
A. M. Gusak and K. N. Tu, “Kinetic theory of flux driven ripening,” Phys. Rev. B, 66, 115403 (2002).
I. M. Lifshiz and V. V. Slezov, J. Phys. Chem. Solids, 19, 35 (1961).
C. Wagner, Z. Electrochem., 65, 581 (1961).
V. V. Slezov, “Theory of Diffusion Decomposition of Solid Solutions,” Harwood Academic Publishers, pp. 99–112 (1995).
D. Turnbull, “Metastable structures in metallurgy,” Metall. Trans. A, 12, 695–708 (1981).
S. Herd, K.N. Tu, and K.Y. Ahn, “Formation of an amorphous Rh-Si alloy by interfacial reaction between amorphous Si and crystalline Rh thin films,” Appl. Phys. Lett., 42, 597 (1983).
R. B. Schwarz and W. L. Johnson, Phys. Rev. Lett., 51, 415 (1983).
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Tu, KN. (2007). Copper–Tin Reactions in Bulk Samples. In: Solder Joint Technology. Springer Series in Materials Science, vol 117. Springer, New York, NY. https://doi.org/10.1007/978-0-387-38892-2_2
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DOI: https://doi.org/10.1007/978-0-387-38892-2_2
Publisher Name: Springer, New York, NY
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