Special Issue of Secure Heterogeneous Integration

SPECIAL ISSUE OVERVIEW:

The semiconductor industry rapidly adopted heterogeneous integration (HI) due to the ever-increasing demand for performance and the need for low-cost integrated circuits (ICs) in high-performance computing data centers, autonomous vehicles, mobile phones, defense, and in various Internet of Things (IoT)/Cyber-Physical Systems (CPS) applications. A new assembly process has been developed to integrate separately manufactured components in a System in Package (SiP) using advanced 2.5D and 3D integration methods. Unfortunately, it opens the pandora’s box of threats as many of these chiplets may be designed, manufactured, and tested in an environment with limited trust and government oversight and can be compromised. An untrusted chiplet may leak secret information as well. Ensuring security for the entire SiP is extremely challenging, as traditional security measures cannot be directly applied. The below fundamental security risks exist in heterogeneous integration, and they are: 1) diverse chiplets manufactured all across the globe, and 2) insecure interposer, where any chiplet can observe the overall system state and can intercept/modify communication/data. The primary objective of this special issue is to develop a set of security measures in heterogeneous integration.

TOPICS OF INTEREST:

1) Chiplet-level and interposer-level security threats for heterogeneous integration.

2) Physical Assurance for heterogeneous integration packaging.

3) Detection and avoidance of hardware Trojans inserted at the interposer or chiplets.

4) Reverse engineering: novel techniques and countermeasures.

5) Side-channel leakage analysis, novel metrics, and countermeasures.

6) Fault-injection attacks and countermeasures.

7) Advanced packaging technologies, including architectures, and applications for 2.5 and 3D, and chiplets, design of TSV, interposer, and SiP.

8) Reliability of 2.5D, Si-bridge, 3D, chiplets, SiP, and heterogeneous integration.

GUEST EDITORS:

Ujjwal Guin, ujjwal.guin@auburn.edu, Auburn University

Navid Asadi Zanjani, nasadi@ece.ufl.edu, University of Florida

IMPORTANT DATES:

Submission Window Opens: January 15, 2023

Submission Deadline: July 01, 2023

Results of first round reviews: September 01, 2023

Major Revision Due: October 01, 2023

Results of second round reviews: November 1, 2023

Submission for the final acceptance: November 15, 2023

Publication material due: December 15, 2023