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Recent Developments in High Temperature Superconductivity pp 285–301Cite as

Universal properties of multilayer high-temperature superconductors: Transition, temperature and a spatial modulation of the gap

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Part of the book series: Lecture Notes in Physics ((LNP,volume 475))

Abstract

We discuss a three-dimensional model high-temperature superconductor, which encompasses both mono- and multilayer systems as planar non-Fermi liquids. Explicitly, we derive the analytic formulae for the superconducting transition temperature T c and for the shape of the space profile of the gap for a material composed of a periodic arrangement of CuO2 planes divided into groups of p≥1 tightly spaced planes. The results are compared with experiment and provide strong support for an interlayer Cooper-pair hopping between the planes as the source of the large T c enhancement in multilayer compounds. Our results are universal in the sense that only general properties of the in-plane pairing potential V kk′ are required to derive them. The results are applicable to both Landau and nonLandau fermionic liquids such as spin-charge separated (Luttinger) and statistical-spin liquids, each of which is also characterized briefly.

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Authors and Affiliations

  1. Institute of Physics, Jagiellonian University, ul.Reymonta 4, 30-059, Kraków, Poland

    Józef Spałek

  2. Institute of Theoretical Physics, Warsaw University, ul.Hoża 69, 00-681, Warszawa, Poland

    Józef Spałek & Krzystof Byczuk

Authors
  1. Józef Spałek
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  2. Krzystof Byczuk
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Jan Klamut Boyd W. Veal Bogdan M. Dabrowski Piotr W. Klamut

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© 1996 Springer-Verlag

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Spałek, J., Byczuk, K. (1996). Universal properties of multilayer high-temperature superconductors: Transition, temperature and a spatial modulation of the gap. In: Klamut, J., Veal, B.W., Dabrowski, B.M., Klamut, P.W. (eds) Recent Developments in High Temperature Superconductivity. Lecture Notes in Physics, vol 475. Springer, Berlin, Heidelberg. https://doi.org/10.1007/BFb0102033

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  • DOI: https://doi.org/10.1007/BFb0102033

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-61631-3

  • Online ISBN: 978-3-540-70695-3

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