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Application of parallel sparse direct methods in semiconductor device and process simulation

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Book cover High Performance Computing (ISHPC 1999)

Part of the book series: Lecture Notes in Computer Science ((LNCS,volume 1615))

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Abstract

We present PARDISO, a new scalable parallel sparse direct linear solver on shared memory multiprocessors. In this paper, we describe the parallel factorization algorithm which utilizes the supernode structure of the matrix to reduce the number of memory references with Level 3 BLAS. We also propose enhancements that significantly reduce the communication rate for pipelining parallelism. The result, is a greatly increased factorization performance. Furthermore, we have investigated popular shared memory multiprocessors and the most popular numerical algorithms commonly used for the solution of the classical drift-diffusion and the diffusion-reaction equations in semiconductor device and process simulation. The study includes a preconditioned iterative linear solver package and our parallel direct linear solver. Moreover, we have investigated the efficiency and the limits of our parallel approach. Results of several simulations of up to 300'000 unknowns for three-dimensional simulations are presented to illustrate our approach towards robust, parallel semiconductor device and process simulation.

The work of O. Schenk was supported by a grant from the Cray Research and Development Grant Program and the Swiss Commission of Technology and Innovation under contract number 3975.1.

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Constantine Polychronopoulos Kazuki Joe Akira Fukuda Shinji Tomita

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© 1999 Springer-Verlag Berlin Heidelberg

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Schenk, O., Gärtner, K., Fichtner, W. (1999). Application of parallel sparse direct methods in semiconductor device and process simulation. In: Polychronopoulos, C., Fukuda, K.J.A., Tomita, S. (eds) High Performance Computing. ISHPC 1999. Lecture Notes in Computer Science, vol 1615. Springer, Berlin, Heidelberg. https://doi.org/10.1007/BFb0094923

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  • DOI: https://doi.org/10.1007/BFb0094923

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-65969-3

  • Online ISBN: 978-3-540-48821-7

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