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Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices

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Book cover Speciality Polymers/Polymer Physics

Part of the book series: Advances in Polymer Science ((POLYMER,volume 88))

Abstract

Epoxy molding compounds for microelectronic devices have been and will continue to be the main stay of encapsulation materials in view of their cost and productivity advantages. On the other hand, as chip sizes become larger due to increased integration of devices, compacter packages are in demand to realize the higher integration. Advances in surface mounting technologies demand encapsulation materials which have extremely low thermal stress and excellent stability at the elevated temperatures used in reflow soldering. Many new technologies have been developed to meet these desires in microelectronic encapsulation. This paper reviews the fundamental properties of epoxy molding compounds and explains the roles and characteristics of the following components which represent encapsulation materials; epoxy resins, hardeners, accelerators, flexibilizers, fillers, flame retardants, coupling agents, and release agents.

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Authors and Affiliations

  1. Hitachi Research Laboratory, Hitachi Ltd., 4026 Kuji-cho, Hitachi-shi, Ibaraki-ken, 319-12, Japan

    Noriyuki Kinjo & Masatsugu Ogata

  2. Musashi Works, Hitachi Ltd., 1450, Josuihon-cho, Kodaira-shi, Tokyo, 187, Japan

    Kunihiko Nishi

  3. Production Engineering Research Laboratory, Hitachi Ltd., 292 Yoshida-cho, Totsuka-ku, Yokohama, 244, Japan

    Aizou Kaneda

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  1. Noriyuki Kinjo
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  2. Masatsugu Ogata
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  3. Kunihiko Nishi
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  4. Aizou Kaneda
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  5. K. Dušek
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© 1989 Springer-Verlag Berlin Heidelberg

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Kinjo, N., Ogata, M., Nishi, K., Kaneda, A., Dušek, K. (1989). Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices. In: Speciality Polymers/Polymer Physics. Advances in Polymer Science, vol 88. Springer, Berlin, Heidelberg. https://doi.org/10.1007/BFb0017963

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  • DOI: https://doi.org/10.1007/BFb0017963

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-662-15081-8

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