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Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices

  • Noriyuki Kinjo
  • Masatsugu Ogata
  • Kunihiko Nishi
  • Aizou Kaneda
  • K. Dušek
Conference paper
Part of the Advances in Polymer Science book series (POLYMER, volume 88)

Abstract

Epoxy molding compounds for microelectronic devices have been and will continue to be the main stay of encapsulation materials in view of their cost and productivity advantages. On the other hand, as chip sizes become larger due to increased integration of devices, compacter packages are in demand to realize the higher integration. Advances in surface mounting technologies demand encapsulation materials which have extremely low thermal stress and excellent stability at the elevated temperatures used in reflow soldering. Many new technologies have been developed to meet these desires in microelectronic encapsulation. This paper reviews the fundamental properties of epoxy molding compounds and explains the roles and characteristics of the following components which represent encapsulation materials; epoxy resins, hardeners, accelerators, flexibilizers, fillers, flame retardants, coupling agents, and release agents.

Keywords

Crosslinking Density Microelectronic Device Linear Thermal Expansion Coefficient Mold Filling Fatigue Crack Propagation Rate 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    Peck DS (1970) 8th Ann. Proc. International Reliability Physics Symposium, p81Google Scholar
  2. 2.
    Brauer JB, Kapfer VC, Tamburrino Al (1970) ibid. p61Google Scholar
  3. 3.
    Bevinton JR, Cook JP, Little DR (1970) ibid. p73Google Scholar
  4. 4.
    Yoshida T, Takahashi T (1982) 20th Ann. Proc. International Reliability Physics Symposium, p268Google Scholar
  5. 5.
    Gunn JE, Mazumdar PM (1979) 17th Ann. Proc. International Reliability Physics Symposium, p48Google Scholar
  6. 6.
    Peeples JW (1978) 16th Ann. Proc. International Reliability Physics Symposium, p154Google Scholar
  7. 7.
    McGarvey WJ (1979) 17th Ann. Proc. International Reliability Physics Symposium, p136Google Scholar
  8. 8.
    Timoshenko S (1955) Strength Materials. 3rd ed., Van NostrandGoogle Scholar
  9. 9.
    Inayoshi H., Nishi K., Okikawa S, Wakashima Y. (1979) 17th Ann. Proc. International Reliability Physics Symposium, p113Google Scholar
  10. 10.
    Kuwata K., Ikoh K, Tabata H (1985) IEEE Trans, on Components, Hybrids, and Manufacturing Technology CHMT-8(4), p486Google Scholar
  11. 11.
    Spencer JL, Schrone WH, Bendnarz GA, Bryan JA, Metzgzr DR (1981) 19th Ann. Proc. International Reliability Physics Symposium, p74Google Scholar
  12. 12.
    Mason WP, Thurston RN (1957) J. Acourst. Soc. Am. 29: 1096Google Scholar
  13. 13.
    Miura H, Nisimura A, Kawai S, Nisi K (1987) Preprint for the 64th Ann. Meeting of JSME, p1821Google Scholar
  14. 14.
    Konda Y (1982) IEEE, Trans. Electron Devices, ED-29: 64Google Scholar
  15. 15.
    Tufte ON, Chapman PW, Long D (1962) J. Appl. Phys. 33: 3322Google Scholar
  16. 16.
    Shinohara M (1982) Plastics in Telecommunications III: 61Google Scholar
  17. 17.
    Okikawa S, Sakimoto M, Tanaka M, Sato T, Toya T, Hara Y (1983) International Symposium on Test and Failure Analysis, p1Google Scholar
  18. 18.
    Okikawa S, Suzuki H, Mikino H (1984) ibid. p180Google Scholar
  19. 19.
    Thomas RE (1985) 35th Ann. Proc. Electric Component Conference, p37Google Scholar
  20. 20.
    Shirley CG, Brish RC (1987) 25th Ann. Proc. International Reliability Physics Symposium, p238Google Scholar
  21. 21.
    Matsumoto H, Yamada M, Fukushima J, Kondoh, T, Kotani N, Tosa M (1985) 23rd Ann. Proc. International Reliability Physics Symposium, p180Google Scholar
  22. 22.
    Nishimura A, Tatemichi A, Miura H, Sakamoto T (1987) 37th Ann. Proc. ECC, p477Google Scholar
  23. 23.
    Yamada Y, Matsumoto H, Fukushima J, Kondoh T (1985) 23th Ann. Proc. International Reliability Physics Symposium, p192Google Scholar
  24. 24.
    Sasaki S, Serizawa K, Kaneda A, Nishi K, Hashizume S (1986) 5th International Conference on Reliability and Maintainability, p482Google Scholar
  25. 25.
    Yasukawa A, Sakamoto T, Shida S (1983) Proc. IEDM 83, p259Google Scholar
  26. 26.
    Mukai J, Kinjo N (1981) Practical Polymers for Engineers. Kodansha Scientific, Tokyo (in Japanese)Google Scholar
  27. 27.
    Paris PC, Erdogan F (1963) Trans. ASME, Series D, 85: 528Google Scholar
  28. 28.
    Shoraka F (1986) 6th Ann. International Electronics Packaging Conf., Proc. of the Technical Conf., p294Google Scholar
  29. 29.
    Comizzoli RB, White LK, Kern W, Schnable GL, Perters DA, Tracy CE, Vibronek RD (1980) 18th Ann. Proc. International Reliability Physics Symposium, p282Google Scholar
  30. 30.
    Berg HM, Paulson WM (1977) J. Electrochem. Soc. Ext. Abstr. 77–1: 33Google Scholar
  31. 31.
    Sato N (1971) Electrochemca Acta, Pergamon Press, 16: 1683Google Scholar
  32. 32.
    Caldwell BP, Albano V (1939) J. Trans. Electrochem. Soc. 76: 271Google Scholar
  33. 33.
    Deltombe E, Vanleugenhaghe C, Pourbaix M (1966) Pergamon Press, Oxford, p168Google Scholar
  34. 34.
    Tsubosaki K, Wakashima Y, Nagashima N (1983) 21th Ann. Proc. International Reliability Physics Symposium, p83Google Scholar
  35. 35.
    Fisher F (1970) 8th Ann. Proc. International Reliability Physics Symposium, p94Google Scholar
  36. 36.
    Sbar NL, Kozakiewticz RP (1978) 16th Ann. Proc. International Reliability Physics Symposium, p161Google Scholar
  37. 37.
    Der Mardderosian A, Gionet V (1978) ibid. p179Google Scholar
  38. 38.
    Paulson WM, Lorigan RP (1976) 14th Ann. Proc. International Reliability Physics Symposium, p42Google Scholar
  39. 39.
    Kolser SC (1974) 12th Ann. Proc. International Reliability Physics Symposium, p155Google Scholar
  40. 40.
    Van de Ven EPGT, Koelmans H (1976) J. Electrochem. Soc. 123: 143Google Scholar
  41. 41.
    Paulson WM, Kirk RW (1974) 12th Ann. Proc. International Reliability Physics Symposium, p172Google Scholar
  42. 42.
    Koelmans H (1974) ibid, p168Google Scholar
  43. 43.
    Altenpohl D (1957) Z. Metallk. 48: 306Google Scholar
  44. 44.
    Altenpohl D (1953) AUuminum 29: 361Google Scholar
  45. 45.
    Wakashima Y, Inayoshi H, Nishi K, Nishida S (1976) 14th Ann. Proc. International Reliability Physics Symposium, p223Google Scholar
  46. 46.
    Shockley W (1964) Surface Science 2: 277Google Scholar
  47. 47.
    Gale RJ (1984) 22th Ann. Proc. International Reliability Physics Symposium, p37Google Scholar
  48. 48.
    Matsumoto T (1986) Kobunshi High Polymer Japan 35: 675Google Scholar
  49. 49.
    May TC, Woods M (1978) 16th Ann. Proc. International Reliability Physics Symposium, p33Google Scholar
  50. 50.
    May TC (1979) Proc. Electronic Component Conference, p247Google Scholar
  51. 51.
    Geilhute M (1979) 18th IEEE Computer Soc. Int. Conf., p201Google Scholar
  52. 52.
    Fukuzawa I, Ishiguro S, Nanbu S (1985) 23th Ann. Proc. International Reliability Physics Symposium, p192Google Scholar
  53. 53.
    Kitayama A, Tabata H, Suzuki H (1986) The 4th International Microelectronics Conference, p462Google Scholar
  54. 54.
    Takada K (1987) NIKKEI NEW MATERIALS 25: 25Google Scholar
  55. 55.
    Salmon ER (1987) Encapsulation of Electronic Devices and Components. Marcel Dekker Inc., New YorkGoogle Scholar
  56. 56.
    Nakagawa O, Sasaki I, Hamamura H, Banjo T (1984) J. Electronic Materials 13: 231Google Scholar
  57. 57.
    Lee H, Neville K (1967) Hand book of Epoxy Resins. McGraw-Hill Inc.Google Scholar
  58. 58.
    Kamon T (1977) Kobunshi Ronbunshu 34: 833Google Scholar
  59. 59.
    Gupta VB, Drzal LT, Lee CYC (1985) Polym. Eng. Sci. 25: 812Google Scholar
  60. 60.
    Varma IK, Bhama PVS (1986) J. Composite Materials 20: 410Google Scholar
  61. 61.
    Hasegawa K, Fukuda A, Tonogai S, Horiuchi H (1984) Kobunshi Ronbunshu 41: 575Google Scholar
  62. 62.
    Day DR (1986) Polym. Eng. Sci. 26: 362Google Scholar
  63. 63.
    Yamagishi M (1986) Electronic Engineering Japan 28: 63Google Scholar
  64. 64.
    Flynn R, Cianciarulo AN (1968) SPE Journal 24: 37Google Scholar
  65. 65.
    Bruins PF (ed) (1968) Epoxy Resin Technology. John Wiley and Sons Inc., New YorkGoogle Scholar
  66. 66.
    Potter WG (1970) Epoxy Resins. Arrowsmith J.W. Ltd.Google Scholar
  67. 67.
    Shechter LW (1956) J. Ind. and Eng. Chem. 48: 86Google Scholar
  68. 68.
    Mih WC (1984) ACS Symp. Ser. No. 242: 273Google Scholar
  69. 69.
    Shimbo M, Nakaya T (1986) J. Polym. Sci., Part B, Polym. Phys. 24: 1931Google Scholar
  70. 70.
    Niino H, Noguchi S (1982) J. Appl. Polym. Sci. 24: 2361Google Scholar
  71. 71.
    Son PN, Weber CD (1973) J. Appl. Polym. Sci. 17: 1305Google Scholar
  72. 72.
    Smith JDB (1979) J. Appl. Polym. Sci. 23: 1385Google Scholar
  73. 73.
    Smith. JDB (1981) J. Appl. Polym. Sci. 26: 979Google Scholar
  74. 74.
    Suzuki H, Sato M, Muroi T, Watanabe Y (1973) Preprint SPE 19th ANTEC p6Google Scholar
  75. 75.
    Hitachi Ltd. USP 3.859.379Google Scholar
  76. 76.
    Belani JG, Sporck CR (1978) SPE Tech. Pap. Annu. Tech. Conf. (Soc. Part Eng.) 24: 557Google Scholar
  77. 77.
    Fujiwara H, Takahashi A., Fujii K, Nakamura K, Sekiya K, Suzuki K (1980) J. of Thermosetting Plastics Japan 1: 14Google Scholar
  78. 78.
    Fujiwara H, Takahashi A, Fujii K, Nakamura K, Suzuki K, Yamada T, Horiuchi H, Tonogai S (1981) ibid. 2: 1Google Scholar
  79. 79.
    Fujiwara H, Yoshinari T, Fujii K, Nakamura K (1983) ibid. 4: 1Google Scholar
  80. 80.
    Shimbo M, Ochi M, Shigeta Y (1981) J. Appl. Polym. Sci. 26: 2265Google Scholar
  81. 81.
    Baker E (1970) IEEE Trans, on Parts, Materials, and Packaging PNP-6: 121Google Scholar
  82. 82.
    Miyake K, Suzuki H, Yamamoto S (1985) IEEE Trans. Rel. R-34: 402Google Scholar
  83. 83.
    Schroen WH, Spencer JL, Bryanand JA, Clevelan RD, Metzgar TD, Edeards DR (1981) 17th Annu. Proc. Rel. Phys., p81Google Scholar
  84. 84.
    Isagawa M, Iwasaki Y, Sutoh T (1980) 18th Annu. Proc. Rel. Phys., p171Google Scholar
  85. 85.
    Kumata K, Iko K, Tabata H (1985) IEEE Trans. on Components, Hybrids, and Manufacturing Technology CHMT-8: 486Google Scholar
  86. 86.
    Nakamura Y, Tabata H, Suzuki H, Iko K (1986) J. Appl. Polym. Sci. 32: 4865Google Scholar
  87. 87.
    Maxwell D, Young RJ, Kinloch AJ (1984) J. Mater. Sci. Lett. 3: 9Google Scholar
  88. 88.
    Butta E, Levita G, Marchetti A, Lazzeri A (1986) Polym. Eng. Sci. 26: 63Google Scholar
  89. 89.
    Bucknall CB, Partridge IK (1986) ibid. 26: 54Google Scholar
  90. 90.
    Manzione LT, Gillham JK (1981) J. Appl. Polym. Sci. 26: 889Google Scholar
  91. 91.
    So P, Broutman LJ (1982) Polym. Eng. Sci. 22: 888Google Scholar
  92. 92.
    Kinloch AJ, Shaw SJ, Tod DA, Hunston DL (1983) Polymer 24: 1341Google Scholar
  93. 93.
    Rosin P, Rammler E (1923) J. Inst. Fuel 7: 29Google Scholar
  94. 94.
    Sundatrom DW, Lee YD (1972) J. Appl. Polym. Sci. 16: 3159Google Scholar
  95. 95.
    Kanari K (1977) KOBUNSHI/High Polymers Japan 26: 557Google Scholar
  96. 96.
    Pinheiro MDF, Rosenberg HM (1980) J. Polym. Sci., Polym. Phis. Ed. 18: 217Google Scholar
  97. 97.
    Nishizawa J, Suyama S (1984) Polyfile 21: 44Google Scholar
  98. 98.
    Nara S, Matsuyama K (1971) J. Macromol. Sci-Chem. A-5: 1205Google Scholar
  99. 99.
    Bremmer BJ (1964) I and EC Product Research and Development 3: 55Google Scholar
  100. 100.
    Lum RM, Feinstein LG (1980) Proc. of the 30th Electronics Components Conference, p113Google Scholar
  101. 101.
    Feinstein LG (1980) ibid. p106Google Scholar
  102. 102.
    Thomas RE, Winchell V, James K, Schar T (1977) Proc. of the 27th Electronics Components Conference, p182Google Scholar
  103. 103.
    Pirron ED, Bobos GE (1977) J. of Electronic Materials 6: 333Google Scholar
  104. 104.
    Sterman S, Marsden JG (1963) Modern Plastics 42: 125Google Scholar
  105. 105.
    Plueddemann EP, Clark HA, Nelson LE, Hoffman KR (1962) Modern Plastics 59: 135Google Scholar
  106. 106.
    Monte SJ, Sugerman G (1978) 33rd Annu. Tech. Conf. Section 2-C: p1Google Scholar
  107. 107.
    Oliver JG (1969) J. Inorg. Nucl. Chem. 31: 1609Google Scholar
  108. 108.
    Kusumoto Chemicals Ltd. (1984) Technical Bolletin No. 201 Google Scholar
  109. 109.
    Hoechst Aktiengesellschaft Product Leaflet 8/84 (1984)Google Scholar
  110. 110.
    Cabot Corp.: Technical Report S-34 (1984)Google Scholar
  111. 111.
    Ogata M, Kawata T, Kinjo N (1987) Koubunshi Ronbunshu 44: 193Google Scholar
  112. 112.
    Sibayama K (1961) Koubunshi Kagaku 18: 183Google Scholar
  113. 113.
    Tobolsky AV, Carlson DW, Indicator N (1961) J. Polym. Sci. 54: 175Google Scholar
  114. 114.
    Shechter L, Wynstra J (1956) Ind. Eng. Chem. 48: 86Google Scholar
  115. 115.
    Kakiuchi H (1987) Polyfile 24: 2Google Scholar
  116. 116.
    Williams ML, Landel RF, Ferry JD (1955) J. Am. Chem. Soc. 77: 3701Google Scholar
  117. 117.
    Funaki Y, Yamaguchi K (1987) NIKKEI MICRODEVICES 22: 55Google Scholar
  118. 118.
    Onuki J, Koizumi M, Araki 1, In pressGoogle Scholar
  119. 119.
    Mooney M (1951) J. Colloid Sci. 6: 162Google Scholar
  120. 120.
    Doi H, Tsuchimoto M, Ono M (1985) Denki Kagaku 53: 282Google Scholar
  121. 121.
    Ikoh K, Tabata H (1986) Zairyo Gijyutsu 4: 27Google Scholar
  122. 122.
    Asai S (1986) Proc. of the IEEE 74: 1623Google Scholar
  123. 123.
    Yamaguchi K, Igarashi K, Tabata H, Suzuki H (1986) IEEE Trans. on Components, Hybrids, and Manufacturing Technology CHMT-9: 370Google Scholar
  124. 124.
    Sundstrom DW, Walters LA, Goff CS (1969) Modern Plastics 10: 101Google Scholar
  125. 125.
    White RP jr (1974) Polym. Eng. Sci. 14: 50Google Scholar
  126. 126.
    Roller MB (1975) ibid. 15: 406Google Scholar
  127. 127.
    Boyer E, Macosco CW (1976) AIChE Journal 22: 268Google Scholar
  128. 128.
    Lipshitz SD, Macosco CW (1976) Polym. Eng. Sci. 16: 803Google Scholar
  129. 129.
    Manzione LT (1981) ibid. 21: 1234Google Scholar
  130. 130.
    Rojas AJ, Adabbo HE, Williams RJJ (1981) ibid. 21: 634Google Scholar
  131. 131.
    Saeki J, Kaneda A, Tanaka M, Tsuchiya K (1984) J. of 9th International Congress on Rheology, p679Google Scholar
  132. 132.
    Kaneda A, Aoki M, Saeki J (1977) Proc. of 1st International Congress of Polymer Processing, p344Google Scholar

Copyright information

© Springer-Verlag Berlin Heidelberg 1989

Authors and Affiliations

  • Noriyuki Kinjo
    • 1
  • Masatsugu Ogata
    • 1
  • Kunihiko Nishi
    • 2
  • Aizou Kaneda
    • 3
  • K. Dušek
  1. 1.Hitachi Research LaboratoryHitachi Ltd.Hitachi-shi, Ibaraki-kenJapan
  2. 2.Musashi WorksHitachi Ltd.Kodaira-shi, Tokyo, 187Japan
  3. 3.Production Engineering Research LaboratoryHitachi Ltd.Totsuka-ku, Yokohama, 244Japan

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