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Machining of Bio-Implant Materials Using WEDM and Optimization of Process Parameters

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Advances in Unconventional Machining and Composites

Part of the book series: Lecture Notes on Multidisciplinary Industrial Engineering ((LNMUINEN))

Abstract

Nonconventional machining is one of the revolutions in present manufacturing scenario. Among various machining techniques, Wire Electrical Discharge Machining (WEDM) is being used to machine biomaterials applied in medical field to machine suitable implant limbs in human body. An attempt is made in the present work to machine Mg AZ31b and SS304 biomaterials on WEDM, with an objective to optimize process parameters. Machining uses brass electrode wire and distilled water as dielectric fluid. Machining consists of linear cut and circular cut by considering Taguchi design of experiments. Input parameters are pulse-on time, pulse-off time, and wire feed. The output consists of Material Removal Rate (MRR), Surface Roughness (SR), and Kerf. Experimental results are validated with antlion optimization technique for optimization of process parameters. Regression analysis is used for validation.

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Authors and Affiliations

  1. Department of Mechanical Engineering, SV University, Tirupati, 517502, India

    P. Hema, J. Mallikarjuna Rao & C. Eswara Reddy

Authors
  1. P. Hema
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  2. J. Mallikarjuna Rao
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  3. C. Eswara Reddy
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Corresponding author

Correspondence to P. Hema .

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Editors and Affiliations

  1. Manufacturing Engineering Section, Department of Mechanical Engineering, Indian Institute of Technology Madras, Chennai, Tamil Nadu, India

    M. S. Shunmugam

  2. Department of Manufacturing Engineering, College of Engineering, Guindy, Anna University, Chennai, Tamil Nadu, India

    M. Kanthababu

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Hema, P., Rao, J.M., Reddy, C.E. (2020). Machining of Bio-Implant Materials Using WEDM and Optimization of Process Parameters. In: Shunmugam, M., Kanthababu, M. (eds) Advances in Unconventional Machining and Composites. Lecture Notes on Multidisciplinary Industrial Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-32-9471-4_32

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  • DOI: https://doi.org/10.1007/978-981-32-9471-4_32

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-32-9470-7

  • Online ISBN: 978-981-32-9471-4

  • eBook Packages: EngineeringEngineering (R0)

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