Abstract
In this paper, an immersion phase change cooling system is designed, in which an electronic fluoride solution is injected into the blade under the design background of the blade server. The system consists of four parallel blade servers with a maximum heating power of 1.2 kW per blade. When the submerged cooling system works normally, the liquid cooling medium is heated by the heating chip in the blade server and phase change occurs. The float continuous level gauge and the liquid cooling source control system make the heating resistance completely immersed in the electronic fluoride solution.
The thermal resistance is used to simulate the heating of electronic devices, and a heat dissipation performance test system is established. The experimental results show that when the cooling system designed in this paper works normally, the surface temperature of the cooled heat source is below 70 C, and the temperature near the resistance on the outside of the blade fluctuates around 71.3 C. The system designed in this paper can run stably and effectively cool the heating parts in the blade.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Xiong, S.M., Wang, Y.H., Zhou, T.J., et al.: Review on immersion phase change cooling. Build. Energy Environ. 37(8), 33–37 (2018)
John, R.S., Avram, B.C., Tien, L., et al.: Fluid selection and property effects in single and two-phase immersion cooling. IEEE Trans. Compon. Hybrids Manuf. Technol. 11(4), 557–565 (1988)
Pramod, W., Aravind, S., Dadasaheb, V.P., et al.: Novel heat transfer fluids for direct immersion phase change cooling of electronic systems. Int. J. Heat Mass Transf. 55, 3379–3385 (2012)
Kang, X., Wang, Y.P., Huang, Q.W., et al.: Phase-change immersion cooling high power light emitting diodes and heat transfer improvement. Microelectron. Reliab. 79, 257–264 (2017)
Mohapatra, S.C.: An overview of liquid coolants for electronics cooling. Electron. Cool. 12(5), 1–6 (2006)
Arik, M., Bar-Cohen, A.: Ebullient cooling of integrated circuits by NOVEC fluids. Adv. Electron. Packag. 2, 625–637 (2001)
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2020 Science Press
About this paper
Cite this paper
Cai, Y., Xue, Y., Chen, X., Feng, Y., Wei, P., Zheng, S. (2020). Investigation for a Phase Change Immersion Cooling System. In: Duan , B., Umeda, K., Hwang, W. (eds) Proceedings of the Seventh Asia International Symposium on Mechatronics. Lecture Notes in Electrical Engineering, vol 589. Springer, Singapore. https://doi.org/10.1007/978-981-32-9441-7_46
Download citation
DOI: https://doi.org/10.1007/978-981-32-9441-7_46
Published:
Publisher Name: Springer, Singapore
Print ISBN: 978-981-32-9440-0
Online ISBN: 978-981-32-9441-7
eBook Packages: Intelligent Technologies and RoboticsIntelligent Technologies and Robotics (R0)