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The Temperature Field Reconstruction of Active Phased Array Antenna Based on POD Method

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Book cover Proceedings of the Seventh Asia International Symposium on Mechatronics

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 589))

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Abstract

When active phased array antenna is in service, the influence of environmental load (such as the non-uniform change of internal TR component temperature) will lead to the change of the output current of the antenna feed network (That is, the excitation current input by the antenna unit), thus affecting the radiation performance of the antenna. Therefore, real-time and accurate response of antenna array temperature field is particularly important. The temperature information of some positions is collected by the temperature sensors, and the temperature field of the whole array is reconstructed under the incomplete information. The reconstruction method of temperature field is based on recursive least squares - linear random estimation. At first, the representative temperature field at several moments will be obtained by using the snapshot method, and then get the POD mode. Finally, LSE method will be applied to solve the coefficients of the POD mode, the lower order model is obtained by orthogonal mapping of the higher order model to the subspace. So the temperature field of antenna array is reconstructed.

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Acknowledgments

This work was supported by National Natural Science Foundation of China (No. 51775405, No. 51490664, No. 51575419), Defense Basic Research Program (No. JCKY2016210B002, No. 61404130405), National Natural Science Foundation of Shaanxi Province under Grant no. 2019JM-010, and “111 Project” under Grant no. B14042.

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Correspondence to Jin-Zhu Zhou .

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Liu, W., Zhou, JZ., Wang, M. (2020). The Temperature Field Reconstruction of Active Phased Array Antenna Based on POD Method. In: Duan , B., Umeda, K., Hwang, W. (eds) Proceedings of the Seventh Asia International Symposium on Mechatronics. Lecture Notes in Electrical Engineering, vol 589. Springer, Singapore. https://doi.org/10.1007/978-981-32-9441-7_35

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