Abstract
Microchannel heat sink many good qualities, such as low thermal resistance, high efficiency, chip integration processing, it has a great application prospect in the field of electronic equipment heat dissipation, but the traditional micro channels radiator have internal flow nonuniformity, the poor temperature uniformity. In order to solve these problems, a new type of microchannel heat sink with cooling pour T type coolant liquid distributor is designed in this paper. we get a conclusion that under the same condition, compared with the conventional straight microchannel heat sink, the highest temperature of fluid structure microchannel heat sink lower 7.4223 °C, the temperature evenness increased 6.35157 °C, the import and export pressure drop almost 33 kPa. The new structure micro-channel radiator has the advantages of better heat dissipation capability, better temperature uniformity and lower pressure drop. When the inlet flow rate is 0.0002 m3/s and the inlet temperature is 20 °C, the new structure microchannel heat sink can take away the quantity of heat of 357.14 W/cm2, the total thermal resistance as low as 0.0162 °C/W.
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Acknowledgments
This work was supported by National Natural Science Foundation of China (No. 51775405, No. 51490664, No. 51575419), Defense Basic Research Program (No. JCKY2016210B002, No. 61404130405), National Natural Science Foundation of Shaanxi Province under Grant no. 2019JM-010, and “111 Project” under Grant no. B14042.
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Yin, L., Wang, M., Zhou, J., Li, T. (2020). Design and Numerical Simulation of a New Microchannel Heat Sink. In: Duan , B., Umeda, K., Hwang, W. (eds) Proceedings of the Seventh Asia International Symposium on Mechatronics. Lecture Notes in Electrical Engineering, vol 589. Springer, Singapore. https://doi.org/10.1007/978-981-32-9441-7_34
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DOI: https://doi.org/10.1007/978-981-32-9441-7_34
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Online ISBN: 978-981-32-9441-7
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