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Experimental Study on Thermal Performance of Aluminous Vapor Chamber

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Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 589))

Abstract

In this paper, a large size aluminous vapor chamber (650 mm × 350 mm × 5 mm) with high effective thermal conductance and light weight was developed for heat dissipation of high heat flux point heat source in aircrafts near space. The heat performance of aluminous vapor chamber (VC) was tested in a power range of 50 W to 159 W. The heat resistance is about 0.2 ℃/W under a heat flux of 25 W/cm2, and the chamber works normally without dryout under a power condition as high as 159 W (~43 W/cm2), which indicates its capability under high heat flux. To enhance thermal performance of aluminous vapor chamber, an integration heat spreader which integrated of advanced carbon materials (annealed pyrolytic graphite, multilayer graphene) and aluminous vapor chamber was fabricated. The test result shows integration heat spreader can significantly reduce the heat spreader resistance of aluminous vapor chamber: the temperature difference between the evaporator section and condenser section decreases from 39.6 ℃ to 9 ℃ under a heat rate of 130 W (heat flux 36.5 W/cm2), while the heat resistance reduces from 0.3 ℃/W to 0.07 ℃/W. Also, the effect of gravity has been studied under horizontal placement and vertical placement. The result shows the thermal resistance under vertical placement is about 3–4 times of that under horizontal placement.

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References

  1. Hu, R., Guo, T., Zhu, X., et al.: A small flat-plate vapor chamber fabricated by copper powder sintering and diffusion bonding for cooling electronic packages. In: IEEE 63rd Electronic Components and Technology Conference, pp. 2280–2285 (2013)

    Google Scholar 

  2. Hsieh, S.S., Lee, R.Y., Shyu, J.C., et al.: Thermal performance of flat vapor chamber heat spreader. Energy Convers. Manag. 49, 1774–1784 (2008)

    Article  Google Scholar 

  3. Karimi, A., Reilly, S., Catton, I.: Enhanced performance of a thermal ground plane utilizing an Inorganic Aqueous Solution. In: Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1235–1243 (2014)

    Google Scholar 

  4. Phan, T.-L., Saito, Y., Mochizuki, M.: Integrated vapor chamber heat spreader for high power processors. In: 2014 International Conference on Electronics Packaging, pp. 424–428 (2014)

    Google Scholar 

  5. Lewis, R., Xu, S., Liew, L.-A., et al.: Thin flexible thermal ground planes: fabrication and scaling characterization. J. Microelectromech. Syst. 24(6), 2040–2048 (2015)

    Article  Google Scholar 

  6. Yang, D., Zhao, R., et al.: Application of aluminous vapor chamber in electronic device cooling system. Electro-Mech. Eng. 30(6), 9–11 (2014)

    Google Scholar 

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Correspondence to Dongdong Zhan .

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Zhan, D., Qian, J., Zhang, Y., Huang, H. (2020). Experimental Study on Thermal Performance of Aluminous Vapor Chamber. In: Duan , B., Umeda, K., Hwang, W. (eds) Proceedings of the Seventh Asia International Symposium on Mechatronics. Lecture Notes in Electrical Engineering, vol 589. Springer, Singapore. https://doi.org/10.1007/978-981-32-9441-7_27

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