Abstract
To realize the active phased array radar antenna BGA encapsulation reliability assessment, A BGA solder joint finite element model is set up, which is based on PCB and HTCC substrate. Combining the creep properties of solder simulated by uniform Anand model, solder joints under temperature cycling stress distribution is studied, and the Coffin-Manson model is used for calculating the solder joint fatigue life by the whole model and organic union method from sub-model. The results show that the thermal stress of the solder ball on the side close to the HTCC while far away from the packaging structure center is the highest, and the fatigue failure happens after 192.3 cycles, which is basically consistent with the experimental results.
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References
Ye-qing, G., Ye, Y., Chao, W.: Integration design of active phased array antenna. Electro-Mech. Eng. 32(6), 29–32 (2016)
Bao-fu, T., Ye-qing, G., Chao, W.: A study on the applications of intelligent structures in phased array antenna. Modern Radar 32(11), 8–10 (2014)
He, Q.-Q., Yao, M., Ren, Z.-G., Zhang, J., Li, Y.: High density integrated design of the incorporate phased array antenna combining with structure and function. Electron. Compon. Mater. 34(5), 61–65 (2015)
Rodgers, B., Flood, B., Punch, J., Waldron, F.: Experimental determination and finite element model validation of the Anand viscoplasticity model constants for SnAgCu, EuroSimE 2005. In: Proceedings of the 6th International Conference on Thermal, pp. 490–496 (2005)
Lili, G., Song-bai, X., Liang, Z., Zhong, S.: Finite element analysis on influencing factors of soldered column reliability in a CCGA device. Trans. China Weld. Inst. 29(7), 93–96 (2009)
Jue, L., Karppinen, J., Laurila, T.: Reliability of lead-free solder interconnections in thermal and power cycling tests. IEEE Trans. Compon. Packag. Technol. 32(2), 302–308 (2008)
Xia, J., Li, G., Li, B., Cheng, L., et al.: Fatigue life prediction of package-on-package stacking assembly under random vibration loading. Microelectron. Reliab. 71, 111–118 (2017)
Xu, F., Li, C., Jiang, T., et al.: Fatigue life prediction for PBGA under random vibration using updated finite element models. Exp. Tech. 40(5), 1421–1435 (2016)
Comsol Homepage: http://cn.comsol.com/model/. Accessed 10 May 2019
Anand, L.: Constitutive equations for the rate-dependent deformation of metals at elevated temperatures. J. Eng. Mater. Technol. Trans. ASME 104(1), 12–17 (1982)
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Tan, L., Tang, W. (2020). Simulation Study on Thermal-Mechanical Coupling of Antenna Array BGA Package. In: Duan, B., Umeda, K., Hwang, W. (eds) Proceedings of the Seventh Asia International Symposium on Mechatronics. Lecture Notes in Electrical Engineering, vol 588. Springer, Singapore. https://doi.org/10.1007/978-981-32-9437-0_4
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DOI: https://doi.org/10.1007/978-981-32-9437-0_4
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