Abstract
With the rapid development of semiconductor, vacuum coating and other industries, integrated vacuum system is widely used. More and more complex working environment puts forward higher requirements for vacuum pipelines and vacuum equipment. Based on the practical engineering background, the thermal-fluid-solid coupling analysis of the front-stage water-cooling pipeline of a vacuum equipment is carried out in this paper. In this paper, the key parameters of fluid-solid coupling heat transfer are theoretically calculated by using the front stage water-cooled vacuum pipeline of molecular pump as the analysis model. The commercial finite element analysis software ANSYS was used to analyze the thermal-fluid-solid coupling of water-cooled vacuum pipeline. The flow field, temperature field and stress field of the pipeline and fluid field were obtained when the requirement was met. The simulation results provide theoretical support and data reference for practical engineering projects.
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Acknowledgments
The authors would like to offer their gratitude to the CBVAC Projects (No. 2017ZX02201006) for providing the research funding and technical support by chief engineer Yi Jin and mechanical engineer Rui Cheng.
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Zhao, D., Jiang, D., Yu, J., Wang, C. (2020). Thermal-Fluid-Solid Coupling Analysis of Water-Cooled Vacuum Pipeline. In: Duan, B., Umeda, K., Hwang, W. (eds) Proceedings of the Seventh Asia International Symposium on Mechatronics. Lecture Notes in Electrical Engineering, vol 588. Springer, Singapore. https://doi.org/10.1007/978-981-32-9437-0_39
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DOI: https://doi.org/10.1007/978-981-32-9437-0_39
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Publisher Name: Springer, Singapore
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Online ISBN: 978-981-32-9437-0
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