Abstract
A structural design of airborne electronic equipment with a total heat consumption of 1205 W and a maximum heat consumption of 105 W for a LRM, which includes 26 functional modules (LRMs) and complicated interconnection among internal LRMs, is introduced. The overall structure and characteristics of the electronic equipment and the design scheme of the liquid cooling system are described in detail. The design scheme has been validated in a certain project to meet the requirements of GJB150A-2009. It has been proved that the equipment has compact structure, reasonable heat dissipation and better mechanical properties. A structural design for similar equipment is provided.
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References
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Wang, J. (2020). Structural Design of a High Heat Consumption at Airborne Electronic Equipment. In: Duan, B., Umeda, K., Hwang, W. (eds) Proceedings of the Seventh Asia International Symposium on Mechatronics. Lecture Notes in Electrical Engineering, vol 588. Springer, Singapore. https://doi.org/10.1007/978-981-32-9437-0_13
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DOI: https://doi.org/10.1007/978-981-32-9437-0_13
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Publisher Name: Springer, Singapore
Print ISBN: 978-981-32-9436-3
Online ISBN: 978-981-32-9437-0
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