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Probing Crystal Plasticity at the Nanoscales pp 53–67Cite as

Electromigration-Induced Plasticity in Cu Interconnects: The Texture Dependence

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Abstract

The discussion of the peculiarities of electromigration in Cu interconnects is continued in this chapter. It is shown that the interconnect texture is an important factor, governing the plastic response of Cu grains to the electrical current. The degree of the plastic response is proportional with the availability of 〈112〉 direction in Cu crystals along the direction of the current. Hence, (111) out-of-plane orientation of Cu grains increases the plastic effect of electromigration, while the presence of the grains with a different orientation could weaken it.

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  1. Singapore University of Technology and Design, Singapore, Singapore

    Arief Suriadi Budiman

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Correspondence to Arief Suriadi Budiman .

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Budiman, A.S. (2015). Electromigration-Induced Plasticity in Cu Interconnects: The Texture Dependence. In: Probing Crystal Plasticity at the Nanoscales. SpringerBriefs in Applied Sciences and Technology. Springer, Singapore. https://doi.org/10.1007/978-981-287-335-4_4

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