Abstract
As the core of power electronic devices, the reliability of IGBT is paid more and more attention. Accelerated aging test has become the most widely used research method. The failure mechanism of IGBT module is analyzed; the power cycle circuits and control strategies commonly used in existing AC/DC aging platforms are compared to provide reference for selecting the optimal scheme. Compared with AC aging platform, DC aging platform has the advantages of simple structure and easy access to state parameters, which is more suitable for AC aging platform. Thermal network method and finite element analysis method are used to obtain the junction temperature of IGBT module.
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Acknowledgments
This work is supported by 2019 Industrial Technology Basic Public Service Platform Project, No. 2019-00896-3-1.
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Sha, Y., Pan, G., Guo, M., Wei, L., Peng, Y. (2022). Research on Accelerated Aging Test and Junction Temperature Detection Method of IGBT. In: Jia, L., Qin, Y., Liang, J., Liu, Z., Diao, L., An, M. (eds) Proceedings of the 5th International Conference on Electrical Engineering and Information Technologies for Rail Transportation (EITRT) 2021. EITRT 2021. Lecture Notes in Electrical Engineering, vol 864. Springer, Singapore. https://doi.org/10.1007/978-981-16-9905-4_14
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DOI: https://doi.org/10.1007/978-981-16-9905-4_14
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