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Reliability Tests and Data Analyses of Solder Joints

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Assembly and Reliability of Lead-Free Solder Joints

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Abstract

Reliability engineering consists of three major tasks [1–14], namely, design for reliability (DFR), reliability testing and data analysis, and failure analysis, as schematically shown in Fig. 6.1. Usually, the procedure starts with a design of the interconnects of a particular semiconductor IC (integrated circuit) package with, e.g., the given chip size, the solder alloys, the molding compound, and the corresponding PCB (printed circuit board) and demonstrates that the design is electrically, thermally, mechanically, and chemically sound. As an example, the DFR activity is often performed with a finite-element simulation using the structural geometry, material properties of all the structural elements and the imposed boundary conditions. The next step in the process is for a certain number of samples of the sound or reliable design to be built and tested under certain conditions for a certain period of time. The test data (failures) then are analyzed and fitted into a life-distribution designation for the interconnects. Failure analysis then should be done on the failed samples to find out the root cause and understand the reason for their failure. In this chapter, reliability testing and data analysis will be discussed and demonstrated through examples. The DFR and failure analysis will be discussed in the next chapters. The definition of reliability will be briefly mentioned first in this chapter.

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References

  1. Lau JH (1990) Design for reliability, reliability testing and data analysis, and failure analysis of solder joints. NEPCON West Workshops, Anaheim, CA, February 1990

    Google Scholar 

  2. Lau JH, Gratalo K, Schneider E, Marcotte T, Baker T (1995) Solder joint reliability of large plastic ball grid array assemblies. J Inst Interconnect Technol 22:27–32

    Google Scholar 

  3. Lau JH, Schneider E, Baker T (1996) Shock and vibration of solder bumped flip chip on organic coated copper boards. J Electron Packag 118:101–104

    Article  Google Scholar 

  4. Lau JH, Lee R (1997) Design for plastic ball grid array solder joint reliability. J Inst Interconnect Technol 23(2):11–13

    Google Scholar 

  5. Lau JH, Pao Y (1997) Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies. McGraw-Hill, New York

    Google Scholar 

  6. Lau JH, Chang C, Chen C (1999) Characteristics and reliability of no-flow underfills for solder bumped flip chip assemblies. Int J Microcircuits Electron Packag 22(4):370–381

    Google Scholar 

  7. Lau JH, Chang C, Lee R (2000) Failure analysis of solder bumped flip chip on low-cost substrates. IEEE Trans Electron Packag Manuf 23(1):19–27

    Article  Google Scholar 

  8. Lau JH, Lee R (2002) Modeling and analysis of 96.5Sn-3.5Ag lead-free solder joints of wafer level chip scale package (WLCSP) on build-up microvia printed circuit board. IEEE Trans Electron Packag Manuf 25(1):51–58

    Article  Google Scholar 

  9. Lau JH, Dauksher W, Smetana J, Horsley R, Shangguan D, Castello T, Menis I, Love D, Sullivan B (2004) Design for lead-free solder joint reliability of high-density packages. J Solder Surf Mount Technol 16(1):12–26

    Article  Google Scholar 

  10. Lau JH, Hoo N, Horsley R, Smetana J, Shangguan D, Dauksher W, Love D, Menis I, Sullivan B (2004) Reliability testing and data analysis of lead-free solder joints for high-density packages. J Solder Surf Mount Technol 16(2):46–68

    Article  Google Scholar 

  11. Lau JH, Smetana J, Horsley R, Snowdon K, Shangguan D, Gleason J, Memis I, Love D, Dauksher W, Sullivan B (2004) Design, materials, and process for lead-free assembly of high-density packages. J Solder Surf Mount Technol 16(1):53–62

    Article  Google Scholar 

  12. Lau JH, Shangguan D, Castello T, Horsley R, Smetana J, Dauksher W, Love D, Menis I, Sullivan B (2004) Failure analysis of lead-free solder joints for high-density packages. J Solder Surf Mount Technol 16(2):69–76

    Article  Google Scholar 

  13. Lau JH, Dauksher W (2005) Reliability of an 1657CCGA (ceramic column grid array) package with 96.5Sn3.9Ag0.6Cu lead-free solder paste on PCBs (printed circuit boards). J Electron Packag 127:96–105

    Article  Google Scholar 

  14. Lau JH (2006) Reliability of lead-free solder joints. J Electron Packag 128:297–301

    Article  Google Scholar 

  15. Keceioglu D (2002) Reliability and life testing handbook, vol 1. DEStech Publication Inc., Lancaster, PA

    Google Scholar 

  16. Kececioglu D (2002) Reliability and life testing handbook, vol 2. DEStech Publication Inc., Lancaster, PA

    Google Scholar 

  17. Pham H (2003) Handbook of reliability engineering. Springer, London

    Book  Google Scholar 

  18. Pham H (2006) Reliability modeling, analysis and optimization. World Scientific, Singapore

    Book  Google Scholar 

  19. Rausand M, Hoyland A (2004) System reliability theory. John Wiley & Sons Inc, Hoboken, NJ

    MATH  Google Scholar 

  20. Ebeling CE (2004) An introduction to reliability and maintainability engineering. McGraw-Hill, Boston

    Google Scholar 

  21. Yang G (2007) Life cycle reliability engineering. John Wiley & Sons Inc, Hoboken, NJ

    Book  Google Scholar 

  22. Birolini A (2010) Reliability engineering. Springer, Berlin Heidelberg

    Book  MATH  Google Scholar 

  23. Baraldi P, Zio E, Cadini F (2011) Basics of reliability and rick analysis. World Scientific Publishing Co, Singapore

    MATH  Google Scholar 

  24. O’Connor P, Kleyner A (2011) Practical reliability engineering. John Wiley & Sons Ltd, Hoboken, NJ

    Book  Google Scholar 

  25. Raheja D, Gullo L (2012) Design for reliability. John Wiley & Sons, Hoboken, NJ

    Book  Google Scholar 

  26. Faber MH (2012) Statistics and probability theory. Springer, Dordrecht

    Book  MATH  Google Scholar 

  27. Klyatis LM (2012) Accelerated reliability and durability testing technology. John Wiley & Sons, Hoboken, NJ

    MATH  Google Scholar 

  28. Elsayed EA (2012) Reliability engineering. John Wiley & Sons, Hoboken, NJ

    MATH  Google Scholar 

  29. Jardine A, Tsang A (2013) Maintenance, replacement, and reliability. Taylor & Francis Inc., Boca Raton, FL

    Book  MATH  Google Scholar 

  30. Gunawan I (2014) Fundamentals of reliability engineering: applications in multistage interconnection network. Scrivener Publishing LLC, Hoboken, NJ

    Book  Google Scholar 

  31. Bedford T, Cooke R (2015) Probabilistic risk analysis. Cambridge University Press, Cambridge

    MATH  Google Scholar 

  32. Beyer B, Jones C, Petoff J, Murphy N (2016) Site reliability engineering. Google Books, Mountain, CA

    Google Scholar 

  33. Modarres M, Kaminskiy M, Krivtsov V (2016) Reliability engineering and risk analysis. Taylor & Francis, Boca Raton, FL

    Book  Google Scholar 

  34. Smith DJ (2017) Reliability maintainability and risk. Elsevier Science & Technology, New York

    Google Scholar 

  35. Damnjanovic I, Reinschmidt K (2019) Data analytics for engineering. Springer, Cham

    Google Scholar 

  36. McPherson JW (2019) Reliability physics and engineering. Springer, Cham

    Book  Google Scholar 

  37. Weibull W (1951) A statistical distribution function of wide applicability. J Appl Mech 18(3):293–297

    MATH  Google Scholar 

  38. Johnson LG (1964) The statistical treatment of fatigue experiments. Elsevier Publishing Company, Amsterdam

    Google Scholar 

  39. Johnson LG (1964) Theory and technique of variation research. Elsevier Publishing Company, Amsterdam

    MATH  Google Scholar 

  40. Johnson LG (1951) The median tanks, of sample values in their population with an application to certain fatigue studies. Ind Math 2:1–9

    Google Scholar 

  41. Mood AM, Graybill F, Boss D (1974) Introduction to the theory of statistics, 3rd edn. McGraw-Hill, New York

    Google Scholar 

  42. Tobias PA, Trindade D (1986) Applied reliability. Van Nostrand Reinhold, New York

    MATH  Google Scholar 

  43. Grant EL, Leavenworth R (1980) Statistical quality control. McGraw-Hill, New York

    MATH  Google Scholar 

  44. Lipson C, Sheth N (1973) Statistical design and analysis of engineering experiments. McGraw-Hill, New York

    Google Scholar 

  45. Lau JH, Li M, Lee NC et al (2018) Reliability of fan-out wafer-level packaging with large chips and multiple re-distributed layers. IEEE/ECTC Proceedings, May 2018, pp 1568–1576

    Google Scholar 

  46. Lau JH, Li M, Fan N, Kuah E, Li Z, Tan K, Chen T, Wu I, Li M, Cheung Y, Wu K, Hao J, Beica R, Taylor T, Ko CT, Yang H, Chen Y, Lim SP, Lee N, Ram J, Wee K, Yong Q, Cao X, Tao M, Lo J, Lee R (2017) Fan-out wafer-level packaging (FOWLP) of large chip with multiple redistribution-layers (RDLs). J Microelectron Electron Packag 14:123–131

    Article  Google Scholar 

  47. Lau JH, Li M, Li Q, Xu I, Chen T, Li Z, Tan K, Qing X, Zhang C, Wee K, Beica R, Ko C, Lim S, Fan N, Kuah E, Wu K, Cheung Y, Ng E, Cao X, Ran J, Yang H, Chen Y, Lee N, Tao M, Lo J, Lee R (2018) Design, materials, process, and fabrication of fan-out wafer-level packaging. IEEE Trans CPMT 8:991–1002

    Google Scholar 

  48. Lau JH, Li M, Tian D, Fan N, Kuah E, Wu K, Li M, Hao J, Cheung Y, Li Z, Tan K, Beica R, Taylor T, Lo CT, Yang H, Chen Y, Lim S, Lee NC, Ran J, Cao X, Koh S, Young Q (2017) Warpage and thermal characterization of fan-out wafer-level packaging. IEEE Trans CPMT 7:1729–1738

    Google Scholar 

  49. Lau JH, Lee NC et al (2018) Warpage measurements and characterizations of FOWLP with large chips and multiple RDLs. IEEE Trans CPMT 8:1729–1737

    Google Scholar 

  50. Lau JH, Lo J, Lam J, Soon E, Chow W, Lee R (2007) Effects of underfills on the thermal-cycling tests of SnAgCu PBGA packages on ImAg PCB. IEEE/EPTC Proceedings, Singapore, December 2007. pp 785–790

    Google Scholar 

  51. Lau JH, Lo J, Lam J, Soon E, Chow W, Lee R (2007) Effects of aging and underfills on mechanical-drop tests of SnAgCu PBGA packages on ImAg PCB. IEEE Proceedings of Electronics Materials and Packaging Conference, October 2007, pp 1–8

    Google Scholar 

  52. Pang JHL, Xiong BS, Neo CC, Zhang XR, Low TH (2003) Bulk solder and solder joint properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloy. IEEE/ECTC Proceedings, May 2003, pp 673–679

    Google Scholar 

  53. Radhakrishhnan J (2008) Effect of board and package attributes on solder joint reliability of FCBGA packages based on IPC9701 characterization. IEEE/ECTC Proceedings, May 2008, pp 1431–1437

    Google Scholar 

  54. Ren G, Collins M (2019) Improved reliability and mechanical performance of Ag microalloyed Sn58Bi solder alloys. Metals, April 2019., pp 1–10

    Article  Google Scholar 

  55. Carpenter B et al (2014) Design and material parameter effects on BGA solder-joint reliability for automotive applications. Proceedings of SMTA International, September 2014, pp 99–111

    Google Scholar 

  56. Carpenter B, Koschmieder T (2015) Solder-joint reliability of 0.8mm BGA packages for automotive applications (2015) Proceedings of SMTA International, Rosemont, IL, September 2015, pp 28–39

    Google Scholar 

  57. Carpenter B (2016) Effects of substrate material and package pad design on solder-joint reliability of 0.8mm pitch BGA. Proceedings of SMTA International, Rosemont, IL, September 2016, pp 453–463

    Google Scholar 

  58. Carpenter B, Yeung B (2017) Solder-joint reliability of a large body molded array package. Proceedings of SMTA International, Rosemont, IL, September 2017, pp 1–10

    Google Scholar 

  59. Carpenter B, Benson M, Mawer A (2018) Solder-joint reliability of a 0.65mm pitch molded array package for automotive applications. Proceedings of SMTA International, September 2018, pp 1–9

    Google Scholar 

  60. Carpenter B et al (2019) Solder-joint reliability of a 0.65mm pitch molded array package for automotive applications. Proceedings of SMTA International, September 2019, pp 270–279

    Google Scholar 

  61. Carpenter B, Mawer A, Benson M, Arthur J, Yeung B (2019) Solder-joint reliability of BGA packages in automotive applications. Proceedings of SMTA International, September 2019., pp 142–148

    Article  Google Scholar 

  62. Sharma G, Lakhera N, Benson M, Mawer A (2019) Advanced fan out wafer level package development for small for factor and high-performance microcontroller applications. Proceedings of the international wafer-level packaging conference, October 2019, pp 1–6

    Google Scholar 

  63. Vasudevan V, Fan X (2008) An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling. IEEE/ECTC Proceedings, May 2008, pp 139–145

    Google Scholar 

  64. Lau J, Dauksher W, Vianco P (2003) Acceleration models, constitutive equations and reliability of lead-free solders and joints. IEEE/ECTC Proceedings, May 2003, pp 229–236

    Google Scholar 

  65. Pan N, Henshall G, Billaut F, Dai S, Strum M, Lewis R, Benedetto E, Rayner J (2005) An acceleration model for Sn-Ag-Cu solder joint reliability under various thermal cycle conditions. SMTA International Conference Proceedings, September 2005, pp 876–883

    Google Scholar 

  66. Miremadi J, Henshall G, Allen A, Benedetto E, Roesch M (2009) Lead-free solder-joint-reliability model enhancement. IMAPS Proceedings, October 2009,. pp 316–323

    Google Scholar 

  67. Lall, P., A. Shirgaokar, D. Arunachalam, (2012) Norris-Landzberg acceleration factor and Goldmann constants for SAC305 lead-free electronics, J Electron Packag, Vol. 134, September 2012, pp. 1–8

    Google Scholar 

  68. Osterman M (2018) Modeling temperature cycle fatigue life of select SAC solders. SMTA International Conference, September 2018

    Google Scholar 

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Authors and Affiliations

  1. Unimicron Technology Corporation, Taoyuan, Taiwan

    John H. Lau

  2. Indium Corporation (United States), Clinton, NY, USA

    Ning-Cheng Lee

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  1. John H. Lau
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  2. Ning-Cheng Lee
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Lau, J.H., Lee, NC. (2020). Reliability Tests and Data Analyses of Solder Joints. In: Assembly and Reliability of Lead-Free Solder Joints. Springer, Singapore. https://doi.org/10.1007/978-981-15-3920-6_6

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  • DOI: https://doi.org/10.1007/978-981-15-3920-6_6

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  • Online ISBN: 978-981-15-3920-6

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