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Solder Joint Characterization

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Assembly and Reliability of Lead-Free Solder Joints

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Abstract

Being a joint, the mechanical properties are the basis of all solder joint characterization. The mechanical properties crucial for quality of most electronic devices include shear and pull strength, and creep properties [1].

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Authors and Affiliations

  1. Unimicron Technology Corporation, Taoyuan, Taiwan

    John H. Lau

  2. Indium Corporation (United States), Clinton, NY, USA

    Ning-Cheng Lee

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  1. John H. Lau
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  2. Ning-Cheng Lee
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Lau, J.H., Lee, NC. (2020). Solder Joint Characterization. In: Assembly and Reliability of Lead-Free Solder Joints. Springer, Singapore. https://doi.org/10.1007/978-981-15-3920-6_5

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  • DOI: https://doi.org/10.1007/978-981-15-3920-6_5

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-15-3919-0

  • Online ISBN: 978-981-15-3920-6

  • eBook Packages: EngineeringEngineering (R0)

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