Abstract
The conventional fluxing fundamental and flux chemistry have been discussed in Soldering Process Chapter. The critical challenges encountered during soldering process have also been reviewed in details. However, with the advancement of electronic industry, novel designs and processes emerged frequently, but criteria on the process yield or reliability of devices are either maintained or even raised. Examples include emergence of bottom-terminated-components (BTC), further advancement of miniaturization, switching from flux-residue-cleaning to no-clean process, probe testable flux residue at in-circuit-test, incorporation of VIPPO design on the board, simultaneous assembly of surface mountable components (SMC) and shield for electromagnetic insulation (EMI), replacing wave soldering with solder paste reflow for through-hole component, etc.
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Lau, J.H., Lee, NC. (2020). Advanced Specialty Flux Design. In: Assembly and Reliability of Lead-Free Solder Joints. Springer, Singapore. https://doi.org/10.1007/978-981-15-3920-6_4
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DOI: https://doi.org/10.1007/978-981-15-3920-6_4
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