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Solder Joints in PCB Assembly and Semiconductor Packaging

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Assembly and Reliability of Lead-Free Solder Joints

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Abstract

Assembly and reliability of lead-free solder joints are very important topics in electronic manufacturing. There are many books [1–69] and papers [70–315] written on them. In this book, the assembly of lead-free solder joints such as prevailing lead-free materials, soldering processes, advanced specialty flux design, and characterization of lead-free solder joints will be discussed, respectively in Chaps. 2–5. The reliability of lead-free solder joints such as reliability testing and data analyses, design for reliability, and failure analyses of lead-free solder joints will be discussed, respectively in Chaps. 6–8. The special features of this book are the materials covered are not only for electronic manufacturing services (EMS) on the second-level interconnects, but also for packaging assembly on the first-level interconnects and for the semiconductor back-end on the 2.5D and 3D IC integration interconnects as shown in Fig. 1.1. The solder joints in various plated-through hole (PTH) and surface mount technology (SMT) printed circuit board (PCB) assemblies, and semiconductor packages will be discussed in this chapter.

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Authors and Affiliations

  1. Unimicron Technology Corporation, Taoyuan, Taiwan

    John H. Lau

  2. Indium Corporation (United States), Clinton, NY, USA

    Ning-Cheng Lee

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Lau, J.H., Lee, NC. (2020). Solder Joints in PCB Assembly and Semiconductor Packaging. In: Assembly and Reliability of Lead-Free Solder Joints. Springer, Singapore. https://doi.org/10.1007/978-981-15-3920-6_1

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