Abstract
Solder joints are a vital part of all electronic systems and play a critical role in ensuring system reliability. However, of late, the failure distribution in electronic systems has shown increase in fatigue failures of solder joints under thermal cycling and vibration load. It is, therefore, essential to estimate the fatigue life of these solder joints if cyclic loads are prominently present in the environment. PLCC package solder joints have been considered in this work to demonstrate the methodology of fatigue life estimation of solder joints. Both finite element analysis and vibration fatigue tests have been used to estimate the parameters of a Basquin model for fatigue. This model predicts the number of cycles to failure of PLCC solder joints for any vibration stress level.
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Khatri, R., Denice, D., Kumar, M. (2020). Estimation of Fatigue Life of PLCC Solder Joints Under Vibration Loading. In: Kapur, P.K., Singh, O., Khatri, S.K., Verma, A.K. (eds) Strategic System Assurance and Business Analytics. Asset Analytics. Springer, Singapore. https://doi.org/10.1007/978-981-15-3647-2_43
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DOI: https://doi.org/10.1007/978-981-15-3647-2_43
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