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Introduction to Vacuum-free Fabrication Strategies for Embedded Metal-mesh Transparent Electrodes

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Novel Embedded Metal-mesh Transparent Electrodes

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Abstract

This chapter introduces EMTE structure and summarizes the key steps in its fabrication. These solution-based fabrication strategies comprises of three major stages i.e. mesh-template patterning on conductive substrate, metal deposition into the mesh-template, and metal-mesh transfer to flexible substrates. We accomplished each of the said steps by utilizing several vacuum-free approaches. For mesh pattering, the methods include photolithography (with and without a stepper), EBL, and NWL while for metal deposition, electrodeposition and electro-less deposition were employed. Similarly, inspired from the thermal NIL and UV-NIL on plastic COC films, imprint transfer methods i.e. thermal imprint transfer and UV-imprint transfer are developed and applied for transferring the metal-meshes onto plastic COC films in embedded form.

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  1. The University of Hong Kong, Pokfulam, Hong Kong

    Dr. Arshad Khan

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Khan, A. (2020). Introduction to Vacuum-free Fabrication Strategies for Embedded Metal-mesh Transparent Electrodes. In: Novel Embedded Metal-mesh Transparent Electrodes. Springer Theses. Springer, Singapore. https://doi.org/10.1007/978-981-15-2918-4_2

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