Abstract
The purpose of this paper is establishing the life prediction model of the IGBT modules in traction converter. Firstly, the failure mechanism of IGBTs and the existing life prediction models is described. Then, according to the special working condition of IGBTs inside TC, a bidirectional accelerated aging experiment was designed, and the experiment proved that loss on free-wheeling diode accelerated the IGBT aging. Then, the Weibull distribution was used to fit the data of accelerated aging experiment of IGBTs, and the parameters of the Weibull distribution were solved by the maximum likelihood method and particle swarm algorithm. Finally, the IGBT life prediction model is established according to the Weibull distribution obtained by this experiment.
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References
Ciappa M, Castellazzi A (2007) Reliability of high-power IGBT modules for traction applications. In: IEEE, pp 480–485
Gao B, Yang F, Chen M et al (2018) Thermal lifetime estimation method of IGBT module considering solder fatigue damage feedback loop. Microelectron Reliab 82:51–61
Chen M, Hu A, Liu B (2011) Failure mechanism and life prediction model analysis of insulated gate bipolar transistors. J Xi’an Jiaotong Univ 45:65–71 (in Chinese)
Zheng T, Huang M, Liu Y, Zha X (2018) Reliability model of bond wire fatigue for IGBT in MMC with system redundancy consideration. Microelectron Reliab 88–90:1164–1167
Patil N, Das D, Goebel K, Pecht M (2008) Identification of failure precursor parameters for Insulated Gate Bipolar Transistors (IGBTs). In: IEEE pp 1–5
Wei L, Chen M, Li R, Wang X, Xu S (2015) Failure mechanism analysis of IGBT under aging test conditions. Proc Chin Soc Electr Eng 35:5293–5300 (in Chinese)
Fang X, Zhou L, Yao D, Du X, Sun P, Wu J et al (2014) Review of IGBT module life prediction model. J Power Supply 2014:14–21 (in Chinese)
Durand C, Klingler M, Coutellier D, Naceur H (2016) Power cycling reliability of power module: a survey. IEEE Trans Device Mater Reliab 16:80–97
Ma K, Liserre M, Blaabjerg F, Kerekes T (2015) Thermal loading and lifetime estimation for power device considering mission profiles in wind power converter. IEEE Trans Power Electr 30:590–602
Xu A (2009) Research on regenerative braking energy utilization technology of urban rail transit. Nanjing University of Aeronautics and Astronautics, Jiangsu. https://doi.org/10.7666/d.d076127. (in Chinese)
Gachovska TK, Tian B, Hudgins JL, Qiao W, Donlon JF (2015) A real-time thermal model for monitoring of power semiconductor devices. IEEE Trans Ind Appl 51:3361–3367
Smet V, Forest F, Huselstein J, Rashed A, Richardeau F (2013) Evaluation of Vce monitoring as a real-time method to estimate aging of bond wire-IGBT modules stressed by power cycling. IEEE Trans Ind Electron 60:2760–2770
Mudholkar GS, Srivastava DK (1993) Exponentiated Weibull family for analyzing bathtub failure-rate data. IEEE Trans Reliab 42:299–302
Jiang R, Wang T (2013) Log-Weibull distribution as a lifetime distribution. In: IEEE; pp 813–816
Bagheri SF, Bahrami Samani E, Ganjali M (2016) The generalized modified Weibull power series distribution: theory and applications. Comput Stat Data Anal 94:136–160
Liu J (2009) The basic theory of particle swarm optimization and improvement. In: Central South University, p 120 (in Chinese)
Acknowledgements
This work is supported by the National Key Research and Development Program of China (No. 2016YFB1200504-C-02).
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Zhu, B., Wang, L., Zhang, L., Li, M., Wang, Y. (2020). Lifetime Prediction Model of IGBT Modules in EMU. In: Jia, L., Qin, Y., Liu, B., Liu, Z., Diao, L., An, M. (eds) Proceedings of the 4th International Conference on Electrical and Information Technologies for Rail Transportation (EITRT) 2019. EITRT 2019. Lecture Notes in Electrical Engineering, vol 638. Springer, Singapore. https://doi.org/10.1007/978-981-15-2862-0_57
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