Abstract
Nowadays, nano-level surface finish is a necessary requirement in different industries. To enhance the performance of a component, nano-level surface roughness is an essential quality. The main drawback of the traditional finishing processes is a longtime requirement for finishing and its dependency on manual labor. The surface morphology requirement of the present era is also very difficult to achieve using conventional finishing processes. Different advanced finishing processes like abrasive flow finishing, elastic emission finishing and magnetic field-assisted finishing processes are developed for achieving nano-level finish. Magnetic field can be used to control finishing forces precisely in magnetic field-assisted finishing processes. Magnetic abrasive finishing and magnetorheological finishing processes belong to this group. Different types of magnetorheological finishing processes are developed to finish a vast selection of components using magnetorheological fluid as the polishing medium. Magnetorheological abrasive flow finishing, rotational magnetorheological abrasive flow finishing, ball end magnetorheological finishing and magnetic field-assisted finishing using novel polishing tool are some of the processes which generate nanometer level surface finishing on flat and free-form surfaces using MR polishing medium. Semiconductor industries use chemical mechanical polishing process due to its planarization capability. Also, CMP process is able to provide nanometer level surface finish in metals and non-metals alike. The required surface characteristics and surface finish in automotive, aerospace, medical and other industries are dependent on the application of the component. These required surfaces can be generated using advanced nano-finishing processes.
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Barman, A., Das, M. (2020). Generation of Nano-Level Surface Finish by Advanced Nano-Finishing Processes. In: Kibria, G., Bhattacharyya, B. (eds) Accuracy Enhancement Technologies for Micromachining Processes. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-15-2117-1_10
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