Abstract
To meet the public and industrial needs, the printed circuit boards (PCBs) must operate with the higher speed and design density. With the increase of the data speed and the design complexity, the interconnect effect becomes the dominant factor of signal degradation. The present book addresses a basic methodology to analyse the printed circuit board electrical interconnects. The chapters elaborate the different analytical methodologies suitable to the interconnect modelling. The methods are applied from the simplex cases of typically single-input single-output (SISO) to complex cases of single-input multiple-output (SIMO) structures. The SIMO interconnects are represented as tree networks.
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Ravelo, B. (2020). General Introduction. In: Ravelo, B. (eds) Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution. Springer, Singapore. https://doi.org/10.1007/978-981-15-0552-2_1
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DOI: https://doi.org/10.1007/978-981-15-0552-2_1
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Publisher Name: Springer, Singapore
Print ISBN: 978-981-15-0551-5
Online ISBN: 978-981-15-0552-2
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